Comparison ledger
KLA 2351 and KLA AIT XUV Darkfield, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | 2351KLA | |
|---|---|---|
| OEM | KLA | KLA |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | Wafer Transfer System | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA 2351 | KLA AIT XUV |
| Specifications | ||
| Configuration | With HDD & Software[1] | Pillar[3] |
| Load Port Qty | 2[1] | — |
| Wavelength Illumination | 370~720 nm[1] | — |
| Wavelength Band | Visible, UV[1] | — |
| Pixel Size | 0.16μm / 0.20μm / 0.25μm / 0.39μm / 0.62μm[1] | — |
| Array Defect Capture Rate | ≥90% (0.16 um, 0.20 um, 0.25 um, 0.39 um, 0.62 um sensitivities)[1] | — |
| Array False Defect Rate | ≤1.5%(all sizes)[1] | — |
| Random Defect Capture Rate | ≥90% (0.16 um, 0.20 um, 0.25 um, 0.39 um, 0.62 um sensitivities)[1] | — |
| Random False Defect Rate | ≤1.5% (all sizes)[1] | — |
| Repeatability | ≥90% (20 consecutive run on the same DSW wafer)[1] | — |
| Wafer size | Wafer Transfer System[1] | — |
| Software Version | — | 6.3.24.3[3] |
| CIM | — | SECS / GEM[3] |
| Factory System | — | FOUPS[3] |
| Handler System | — | Robot[3] |
| Missing Parts | — | Incomplete Wafer Handler Module & Inspection Module[3] |
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