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Comparison ledger

2351 versus MicroSense UMSC 200 BT Measurement

KLA 2351 and KLA MicroSense UMSC 200 BT Measurement, side by side. Every value shown is drawn from its cited encyclopedia entry.

Side-by-side comparison of selected equipment models
Attribute
2351KLA
OEMKLAKLA
CategoryMetrology & InspectionMetrology & Inspection
Wafer sizeWafer Transfer System
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones
Control system
Generation
FamilyKLA 2351KLA MicroSense
Specifications
ConfigurationWith HDD & Software[1]10 A[3]
Load Port Qty2[1]
Wavelength Illumination370~720 nm[1]
Wavelength BandVisible, UV[1]
Pixel Size0.16μm / 0.20μm / 0.25μm / 0.39μm / 0.62μm[1]
Array Defect Capture Rate≥90% (0.16 um, 0.20 um, 0.25 um, 0.39 um, 0.62 um sensitivities)[1]
Array False Defect Rate≤1.5%(all sizes)[1]
Random Defect Capture Rate≥90% (0.16 um, 0.20 um, 0.25 um, 0.39 um, 0.62 um sensitivities)[1]
Random False Defect Rate≤1.5% (all sizes)[1]
Repeatability≥90% (20 consecutive run on the same DSW wafer)[1]
Wafer sizeWafer Transfer System[1]
Voltage120 V[3]
Main Air Pressure50 PSI[3]
Stage Air Pressure5 Psi[3]
Measurement TypeFlatness & Thickness[3]
System TypeNon-contact Measurement[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]inventory listing