Comparison ledger
KLA 2351 and KLA P 22 H Surface, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | 2351KLA | |
|---|---|---|
| OEM | KLA | KLA |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | Wafer Transfer System | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA 2351 | KLA P |
| Specifications | ||
| Configuration | With HDD & Software[1] | Step Height Precision Micro 2D Scanner[3] |
| Load Port Qty | 2[1] | — |
| Wavelength Illumination | 370~720 nm[1] | — |
| Wavelength Band | Visible, UV[1] | — |
| Pixel Size | 0.16μm / 0.20μm / 0.25μm / 0.39μm / 0.62μm[1] | — |
| Array Defect Capture Rate | ≥90% (0.16 um, 0.20 um, 0.25 um, 0.39 um, 0.62 um sensitivities)[1] | — |
| Array False Defect Rate | ≤1.5%(all sizes)[1] | — |
| Random Defect Capture Rate | ≥90% (0.16 um, 0.20 um, 0.25 um, 0.39 um, 0.62 um sensitivities)[1] | — |
| Random False Defect Rate | ≤1.5% (all sizes)[1] | — |
| Repeatability | ≥90% (20 consecutive run on the same DSW wafer)[1] | — |
| Wafer size | Wafer Transfer System[1] | — |
| Scan Length | — | 60 mm[3] |
| Scan Speed | — | 1 um/sec to 25mm/ sec[3] |
| Scan Method | — | Bi-directional moving stylus[3] |
| Sampling Rate | — | 5, 10, 20, 50, 100, 200, 500 , 1000 Hz[3] |
| Stylus Force | — | Adjustable between 0.05 ~ 50mg[3] |
| Step Height Repeatability, 1 | — | 0.75 nm or 0.1%:Sample Handling:[3] |
| Theta | — | 360[3] |
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