Comparison ledger
KLA .496 PSL Wafer, Koh Young KY 8030 3 3D, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | KY 8030 3 3DKoh Young | |
|---|---|---|
| OEM | KLA | Koh Young |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA .496 PSL Wafer | Koh Young KY 8030 3 3D |
| Specifications | ||
| Configuration | NIST Traceable[1] | 50/60 Hz[3] |
| Wafer size | 8 inch[1] | — |
| Traceability | NIST Traceable[1] | — |
| Compatible systems | Capable on Surfscan 6xy0 and SP1[1] | — |
| Category | Metrology & Inspection[2] | — |
| Phase | — | 1 Phase[3] |
| Voltage | — | 220 Vac[3] |
| OEM | — | Koh Young[4] |
| Model | — | KY 8030 3[4] |
| Equipment type | — | 3D Solder Paste Inspection[4] |
| Electrical configuration | — | 1 Phase - 50/60 Hz - 220 Vac[3] |
| Vintage | — | 2013[3] |
| Machine type | — | 3D solder paste inspection[4] |
| Make | — | Koh Young[4] |
| Tool family | — | KY 8030 3 3D[5] |
| Inspection technology | — | Patented dual-projection 3D dual-inspection and Moiré interferometry, shadow-free measurement[6] |
| Camera | — | 8MP industrial color camera with telecentric lens[6] |
| Available resolution | — | 15μm / 20μm / 25μm[6] |
| FOV options | — | 30×30mm / 40×40mm / 50×50mm[6] |
| Z-axis resolution | — | 0.37μm[6] |
| Height measuring accuracy | — | ±1μm[6] |
| Min detectable component | — | 01005 chip[6] |
| Min solder pitch | — | 100μm[6] |
| Light source | — | IR+RGB multi-band LED structured light[6] |
| PCB size range | — | Single track: 50×50 ~ 490×510mm; max option: 50×50 ~ 850×690mm[6] |
| Power supply | — | AC220V/200-240V, 50/60Hz, single phase[6] |
| Air requirement | — | 5kgf/cm² (0.5MPa), standard factory compressed air[6] |
| Machine dimensions | — | W1000×D1335×H1627mm[6] |
| Net weight | — | 800kg[6] |
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