Comparison ledger
KLA 5200 and KLA F 60 C XT Film Thickness Measurement, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | 5200KLA | |
|---|---|---|
| OEM | KLA | KLA |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA 5200 | KLA F |
| Specifications | ||
| Measurement technology | Coherence Probe Microscopy (CPM), a patented white-light interferometric technique[1] | — |
| Targets measured | Surfaces, including low-contrast or grainy targets[1] | — |
| Feature size capability stated | Down to 0.18 µm[1] | — |
| Software | Built-in analysis software[1] | 2.7.0.0[2] |
| User interface | Graphical user interface[1] | — |
| Wafer Handling | — | x1 Open Cassette Loader[2] |
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