Comparison ledger
KLA AIT XUV Darkfield and KLA D600, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | D600KLA | |
|---|---|---|
| OEM | KLA | KLA |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | 2" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | D-series |
| Family | KLA AIT XUV | KLA D600 |
| Specifications | ||
| Software Version | 6.3.24.3[1] | — |
| CIM | SECS / GEM[1] | — |
| Factory System | FOUPS[1] | — |
| Handler System | Robot[1] | — |
| Configuration | Pillar[1] | — |
| Missing Parts | Incomplete Wafer Handler Module & Inspection Module[1] | — |
| Instrument type | — | Stylus surface profiler[2] |
| Measurement purpose | — | Thin and thick film step height measurement[2] |
| Wafer compatibility | — | 2", 4", 6", and 8" wafers[2] |
| Field of view | — | 3780 x 3120 um[2] |
| Digital zoom | — | x4[2] |
| Scan length range | — | 55 mm with stitching option[2] |
| Vertical range | — | 1 mm[2] |
| Step-height repeatability | — | 5A[2] |
| Force range | — | 0.03 to 15 mg[2] |
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