Comparison ledger
KLA D600 and KLA FLX 2320 A, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | D600KLA | FLX 2320 AKLA |
|---|---|---|
| OEM | KLA | KLA |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | 2" | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | D-series | — |
| Family | KLA D600 | KLA FLX 2320 |
| Specifications | ||
| Instrument type | Stylus surface profiler[1] | — |
| Measurement purpose | Thin and thick film step height measurement[1] | — |
| Wafer compatibility | 2", 4", 6", and 8" wafers[1] | — |
| Field of view | 3780 x 3120 um[1] | — |
| Digital zoom | x4[1] | — |
| Scan length range | 55 mm with stitching option[1] | — |
| Vertical range | 1 mm[1] | — |
| Step-height repeatability | 5A[1] | — |
| Force range | 0.03 to 15 mg[1] | — |
| Configuration | — | Thin film stress measurement system[2] |
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