Waferpedia

Comparison ledger

D600 versus P-2

KLA D600 and KLA P-2, side by side. Every value shown is drawn from its cited encyclopedia entry.

Side-by-side comparison of selected equipment models
Attribute
D600KLA
P-2KLA
OEMKLAKLA
CategoryMetrology & InspectionMetrology & Inspection
Wafer size2"200mm
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones
Control system
GenerationD-series
FamilyKLA D600KLA P-2
Specifications
Instrument typeStylus surface profiler[1]
Measurement purposeThin and thick film step height measurement[1]
Wafer compatibility2", 4", 6", and 8" wafers[1]
Field of view3780 x 3120 um[1]
Digital zoomx4[1]
Scan length range55 mm with stitching option[1]
Vertical range1 mm[1]
Step-height repeatability5A[1]
Force range0.03 to 15 mg[1]
ModelP-2[2]
OEMKLA Tencor[2]
Equipment typeProfilometer[2]
Sample table200 mm sample table with vacuum[3]
Measurement rangeMeasures steps from 100 Å to 300 µm[3]
Maximum sample thickness20 mm[3]
Minimum sample length25 mm[3]
Feature3D scan option[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]epfl.chepfl.ch
  2. [2]nanofab.ece.cmu.edunanofab.ece.cmu.edu
  3. [3]nanofab.ece.cmu.edunanofab.ece.cmu.edu