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Comparison ledger

Flexus F 2320 I Stress MeasurementversusS-460

KLA Flexus F 2320 I Stress Measurement, Signatone S-460, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
S-460Signatone
OEMKLASignatone
CategoryTest & ProbeTest & Probe
Wafer size6"6"
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones1991 Vintage—
Control system—Windows
Generation——
FamilyKLA Flexus F 2320 I Stress MeasurementSignatone S-460
Specifications
ConfigurationDual Wavelength[1]—
Software Version2.0[1]—
Operating SystemMS-DOS V6.22[1]—
Voltage115V[1]—
Current10A[1]—
Wafer sizeThis system comes with an alignment/centering ring for a 6" wafer[1]6"[2]
Wafer Sizes6 inch, 8 inch[1]—
Vintage1991[1]—
MeasurementDual Wavelength[1]—
ManufacturerKLA[1]—
ModelFlexus F 2320 I[1]—
Wafer sizes6 in, 8 in[1]—
OpticsDual Wavelength[1]—
Alignment/centering ringIncludes an alignment/centering ring for a 6" wafer[1]—
8-inch wafer alignment toolDoes not have any alignment tool for an 8" wafer[1]—
Probe station type—Semi-automatic probe station[2]
Wafer stage drive—Proprietary linear induction motor[2]
Positioning system—Optical feedback positioning system[2]
Wafer stepping—Automated wafer stepping controlled via Signatone Solutions Windows software[2]
Theta—Motorized theta with a quick two-point align feature[2]
Control era—Windows[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]web.archive.orgweb.archive.org
  3. [3]waferpedia.comwaferpedia.com