Comparison ledger
KLA Flexus F 2320 I Stress Measurement, Tenney , TPS JR-A-F4T Junior compact temperature test chambers, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ||
|---|---|---|
| OEM | KLA | Tenney |
| Category | Test & Probe | Test & Probe |
| Wafer size | 6" | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | 1991 Vintage | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA Flexus F 2320 I Stress Measurement | Tenney , TPS JR-A-F4T Junior compact temperature test chambers |
| Specifications | ||
| Configuration | Dual Wavelength[1] | — |
| Software Version | 2.0[1] | — |
| Operating System | MS-DOS V6.22[1] | — |
| Voltage | 115V[1] | — |
| Current | 10A[1] | — |
| Wafer size | This system comes with an alignment/centering ring for a 6" wafer[1] | — |
| Wafer Sizes | 6 inch, 8 inch[1] | — |
| Vintage | 1991[1] | — |
| Measurement | Dual Wavelength[1] | — |
| Manufacturer | KLA[1] | Tenney[2] |
| Model | Flexus F 2320 I[1] | JR-A-F4T[2] |
| Wafer sizes | 6 in, 8 in[1] | — |
| Optics | Dual Wavelength[1] | — |
| Alignment/centering ring | Includes an alignment/centering ring for a 6" wafer[1] | — |
| 8-inch wafer alignment tool | Does not have any alignment tool for an 8" wafer[1] | — |
| Chamber Size | — | 1.2 cubic feet[2] |
| Temperature Range | — | -68°C to +180°C[2] |
| Control | — | +/-1.0°C[2] |
| Short description | — | Junior compact temperature test chambers[2] |
| Control accuracy | — | +/-1.0°C[2] |
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