Comparison ledger
KLA FLX 2320 and KLA P-2, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | FLX 2320KLA | P-2KLA |
|---|---|---|
| OEM | KLA | KLA |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | 200mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA FLX 2320 | KLA P-2 |
| Specifications | ||
| Configuration | Refurbished[1] | — |
| Dual Wavelength Scanning | 670 nm, 785 nm[1] | — |
| Software Version | 4.4[1] | — |
| Operation Manual | Digital Copy[1] | — |
| Model | — | P-2[2] |
| OEM | — | KLA Tencor[2] |
| Equipment type | — | Profilometer[2] |
| Sample table | — | 200 mm sample table with vacuum[3] |
| Measurement range | — | Measures steps from 100 Å to 300 µm[3] |
| Maximum sample thickness | — | 20 mm[3] |
| Minimum sample length | — | 25 mm[3] |
| Feature | — | 3D scan option[3] |
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