KLA
FLX 2320
The KLA FLX 2320 is a thin-film stress measurement tool for wafers. The KLA FLX 2320 measures wafer curvature before and after film deposition to calculate film stress. The KLA FLX 2320 supports 4, 5, 6, and 8 inch wafer sizes.[1]
What it is
The KLA FLX 2320 is a thin-film stress measurement tool used in semiconductor metrology and inspection. It measures changes in wafer curvature caused by deposited films and can also be used to derive elastic constants and thermal expansion coefficients when film and substrate thickness are known.[3][1]
How it works
Where it fits in the process flow
Applications
The tool is used for film stress measurement, stress characterization of membranes, stress mapping, and measuring stress as a function of temperature. It is also used to assess wafer curvature and to minimize stress in multilayer thin films.[1]
What do the numbers mean?
Wafer handling1
Optics & imaging4
Performance1
Control & software4
Dimensions & facilities1
Configuration & options8
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What does the FLX 2320 measure?
The FLX 2320 measures wafer curvature before and after film deposition and uses the change in curvature to calculate stress on the deposited film.[1]
Not publicly documented
The following facts about the FLX 2320 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the FLX 2320 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the FLX 2320 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the FLX 2320 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the FLX 2320 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the FLX 2320 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (6)Every fact above is drawn from these public sources
- [1]nist.gov — nist.govnist.gov
- [2]inventory listing
- [3]Film Stress Tencor FLX-2320 | Utah Nanofab — nanofab.utah.edunanofab.utah.edu
- [4]Metrology ‒ Center of MicroNanoTechnology CMi ‐ EPFL — epfl.chepfl.ch
- [5]Fab.nano Equipment Rates START.nano March 2026 0 — nanousers.mit.edunanousers.mit.edu
- [6]KLA-Tencor | Products | Alpha-Step 500 — tencor.com (Jul 27, 2003)web.archive.org
Last updated Oct 21, 2026.
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