KLA
The KLA FLX 2320 is a thin-film stress measurement tool used in semiconductor metrology and inspection. It measures changes in wafer curvature caused by deposited films and can also be used to derive elastic constants and thermal expansion coefficients when film and substrate thickness are known.[2][3]
The tool is used for film stress measurement, stress characterization of membranes, stress mapping, and measuring stress as a function of temperature. It is also used to assess wafer curvature and to minimize stress in multilayer thin films.[3]
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It measures wafer curvature before and after film deposition to calculate deposited-film stress.[3]
Supported wafer diameters are three inch, four inch, six inch, and eight inch.[3]
Yes. Two-dimensional mapping of stress is supported.[3]
The following facts about the FLX 2320 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the FLX 2320 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the FLX 2320 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the FLX 2320 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the FLX 2320 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the FLX 2320 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Jul 30, 2026.
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The KLA 0035235-003 MMD Head is a TSTD PCB ASSY, MMD MEAS HEAD compatible with the KLA AIT-XP.