Waferpedia

Comparison ledger

Profilm 3D Waferversus, TPS JR-A-F4T Junior compact temperature test chambers

KLA Profilm 3D Wafer, Tenney , TPS JR-A-F4T Junior compact temperature test chambers, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
OEMKLATenney
CategoryTest & ProbeTest & Probe
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyKLA ProfilmTenney , TPS JR-A-F4T Junior compact temperature test chambers
Cited variants
  • Profilm3D-200[1]
—
Specifications
Objective100x[2]—
Product familyFilmetrics Profilm3D optical profilometer[1]—
Measurement typeNon-contact 3D surface topography measurement[1]—
Measurement techniquesWhite light interferometry (WLI) and phase shifting interferometry (PSI)[1]—
Objective lens range5X to 100X[1]—
Wafer stage supportManual R-theta wafer stage supporting 50mm to 200mm diameter wafers[1]—
X-Y stage travel100mm x 100mm travel[3]—
Z stage range100mm[3]—
Piezo travel500μm[3]—
Sample max weight2.5kg[3]—
Camera2592 x 1944 (5MP)[3]—
Chamber Size—1.2 cubic feet[4]
Temperature Range—-68°C to +180°C[4]
Control—+/-1.0°C[4]
Manufacturer—Tenney[4]
Model—JR-A-F4T[4]
Short description—Junior compact temperature test chambers[4]
Control accuracy—+/-1.0°C[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]kla.comkla.com
  2. [2]inventory listing
  3. [3]kla.comkla.com
  4. [4]dealer listingwotol.com