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KLA

Profilm 3D Wafer

Test & ProbeKLA Profilm family
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The KLA Profilm 3D Wafer is a Filmetrics Profilm3D optical profilometer. The KLA Profilm 3D Wafer performs non-contact 3D surface topography measurements using white light interferometry and phase shifting interferometry. The KLA Profilm 3D Wafer supports a manual R-theta wafer stage for 50mm to 200mm diameter wafers.[1][2]

Profilm 3D Wafer — Inventory photo
Fig. 01Profilm 3D WaferInventory photo[3]

What it is

The KLA Filmetrics Profilm3D is an optical profilometer for non-contact 3D surface topography measurement. The Profilm3D series uses white light interferometry and includes a Profilm3D-200 variant in the product family. The Profilm3D supports simple recipe setup for single scans or automated measurements on multiple sites for both R&D and production environments.[1][2]

How it works

General reference — not yet source-verified

Interference-based profilometers form height maps by analyzing optical path differences while the instrument scans through focus. Optical profilometers typically combine imaging optics, precision vertical motion, stage positioning, and software analysis to reconstruct surface form and extract dimensional results.

Where it fits in the process flow

General reference — not yet source-verified

Optical profilometers sit in metrology and process characterization rather than in patterning, deposition, or etch themselves. Optical profilometers are commonly used between process steps and after process completion to verify that a surface or feature matches the intended topography before later integration or release.

Applications

General reference — not yet source-verified

Optical profilometers are used wherever surface form or relief must be measured without stylus contact. Optical profilometers are well suited to fragile, soft, patterned, reflective, and transparent or partially transparent samples when the process question is about topography rather than electrical behavior.

What do the numbers mean?

Vacuum & pumping1

Measurement techniques
White light interferometry (WLI) and phase shifting interferometry (PSI)[1]
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Wafer handling1

Wafer stage support
Manual R-theta wafer stage supporting 50mm to 200mm diameter wafers[1]
Accurate?

Optics & imaging4

Objective
100x[3]
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Product family
Filmetrics Profilm3D optical profilometer[1]
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Objective lens range
5X to 100X[1]
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Camera
2592 x 1944 (5MP)[2]
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Dimensions & facilities1

Sample max weight
2.5kg[2]
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Configuration & options4

Measurement type
Non-contact 3D surface topography measurement[1]
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X-Y stage travel
100mm x 100mm travel[2]
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Z stage range
100mm[2]
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Piezo travel
500μm[2]
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Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
Profilm3D-200——Adds a larger motorized X-Y stage with 200mm by 200mm travel.kla.com[1]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Measurement techniquesWhite light interferometry (WLI) and phase shifting interferometry (PSI)[1]

Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What measurement methods does the Profilm3D use?

The Profilm3D family uses white light interferometry, phase shifting interferometry, and Enhanced Roughness Mode to produce 3D surface measurements, profiles, and true-color images.[2]

Not publicly documented

The following facts about the Profilm 3D Wafer are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Profilm 3D Wafer are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the Profilm 3D Wafer are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the Profilm 3D Wafer are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the Profilm 3D Wafer is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the Profilm 3D Wafer are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]kla.com — kla.comkla.com
  2. [2]kla.com — kla.comkla.com
  3. [3]Inventory photo
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Last updated Oct 17, 2026.

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