KLA
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The KLA Profilm 3D Wafer is a Filmetrics Profilm3D optical profilometer. The KLA Profilm 3D Wafer performs non-contact 3D surface topography measurements using white light interferometry and phase shifting interferometry. The KLA Profilm 3D Wafer supports a manual R-theta wafer stage for 50mm to 200mm diameter wafers.[1][2]

The KLA Filmetrics Profilm3D is an optical profilometer for non-contact 3D surface topography measurement. The Profilm3D series uses white light interferometry and includes a Profilm3D-200 variant in the product family. The Profilm3D supports simple recipe setup for single scans or automated measurements on multiple sites for both R&D and production environments.[1][2]
Interference-based profilometers form height maps by analyzing optical path differences while the instrument scans through focus. Optical profilometers typically combine imaging optics, precision vertical motion, stage positioning, and software analysis to reconstruct surface form and extract dimensional results.
Optical profilometers sit in metrology and process characterization rather than in patterning, deposition, or etch themselves. Optical profilometers are commonly used between process steps and after process completion to verify that a surface or feature matches the intended topography before later integration or release.
Optical profilometers are used wherever surface form or relief must be measured without stylus contact. Optical profilometers are well suited to fragile, soft, patterned, reflective, and transparent or partially transparent samples when the process question is about topography rather than electrical behavior.
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Profilm3D-200 | — | — | Adds a larger motorized X-Y stage with 200mm by 200mm travel. | kla.com[1] |
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The Profilm3D family uses white light interferometry, phase shifting interferometry, and Enhanced Roughness Mode to produce 3D surface measurements, profiles, and true-color images.[2]
The following facts about the Profilm 3D Wafer are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Profilm 3D Wafer are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the Profilm 3D Wafer are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Profilm 3D Wafer are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Profilm 3D Wafer is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Profilm 3D Wafer are on record.
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Last updated Oct 17, 2026.
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