Comparison ledger
KLA Surfscan SP 1 DLS, Strasbaugh 100R16, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 100R16Strasbaugh | |
|---|---|---|
| OEM | KLA | Strasbaugh |
| Category | CMP | CMP |
| Wafer size | For Wafer Centering Device | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA Surfscan | Strasbaugh 100R16 |
| Specifications | ||
| Configuration | Upgraded/New[1] | — |
| Wafer size | For Wafer Centering Device[1] | — |
| Defect Sensitivity (Polished Bare Silicon) | 0.050 µm[2] | — |
| Laser Source | Argon Ion Laser (488 nm)[2] | — |
| Wafer Size Support | 200 mm and 300 mm[2] | — |
| Enhanced Rough Film Sensitivity | Yes[2] | — |
| Real Time Defect Classification (RTDC) | Yes[2] | — |
| Defect Map and Histogram with Zoom | Yes[2] | — |
| Map to Map | Yes[2] | — |
| Operator Interface | Yes[2] | — |
| Blower Unit | Yes[2] | — |
| OEM | KLA-Tencor[2] | — |
| Model | SP1 DLS[3] | — |
| Wafer Size | 200/300mm[2] | — |
| Defect Sensitivity | 0.050um on polished bare silicon[2] | — |
| Surface Type | Unpatterned[2] | — |
| Key Feature | Enhanced Rough Film Sensitivity[2] | — |
| Optional Handler | 300mm Single FOUP/FIMS Handler[2] | — |
| type | — | 1 spindle grinder/polisher[4] |
| drive system | — | DC drive system with 2 motors[4] |
| spindle RPM | — | 1-180 RPM[4] |
| eccentric RPM | — | 1-90 RPM[4] |
| controls | — | digital timer; air down switch; spindle and eccentric speed dials; air regulators[4] |
| capacity | — | 16 inches[4] |
| spindle size | — | 1-8 TPI[4] |
| overall dimensions | — | 28 inches x 36 inches x 48 inches[4] |
| weight | — | 500 lbs[4] |
| origin | — | made in the USA[4] |