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Comparison ledger

2300 Kiyo EXversus110

Lam Research 2300 Kiyo EX, Tegal 110, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
2300 Kiyo EXLam Research
110Tegal
OEMLam ResearchTegal
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLam Research 2300Tegal 110
Cited variants—
Specifications
ConfigurationPolysilicon[2]—
OEMLam Research[3]—
Model2300 Kiyo EX[2]—
DescriptionPolysilicon Etch[3]—
Equipment typeEtch/Ash/Clean - Plasma Processing Equipment[3]—
Currently configured for300 mm[3]—
Tool modelKIYOEX[3]—
System power rating208 AC 3-Phase[3]—
Loading configuration3 Load ports[3]—
ChambersChamber 1, Chamber 2, Chamber 3[3]—
Chamber descriptionsKIYOEX, KIYOEX, KIYOEX[3]—
Process TypePolysilicon Etch[3]—
Wafer Size300mm[3]—
Load Ports3[3]—
Chamber TypeKIYOEX[3]—
N2 Load Port VendorJUSTEM[3]—
Tool designationLAM Research 2300 KIYO EX[3]—
ProcessPolysilicon etch[3]—
Chamber count3 chambers[3]—
Chamber namesChamber 1: 1; Chamber 2: 2[3]—
model—110 SE[1]
application focus—process development applications[1]
process capability—deep silicon plasma etching[1]
capabilities—very high aspect ratio trench etch and profile control[1]
configuration—multiple configurations with minimum technical intervention[1]
System type—plasma etch system[4]
Supported components—MEMS and 3D-IC components[1]
Control capability—very high aspect ratio trench etch and profile control[4]
Physical description—compact[1]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]inventory listing
  3. [3]macquarie.commacquarie.com
  4. [4]waferpedia.comwaferpedia.com