Waferpedia

Comparison ledger

4520 XLEversus110

Lam Research 4520 XLE, Tegal 110, side by side. Every value shown is drawn from the cited encyclopedia entries.

Email
Side-by-side comparison of selected equipment models
Attribute
4520 XLELam Research
110Tegal
OEMLam ResearchTegal
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLam Research Rainbow 4520Tegal 110
Cited variants—
Specifications
ConfigurationParts System[2]—
TypeEtcher[3]—
MakeLam[3]—
Wafer size8 inch[3]—
Listing typeParts System[2]—
model—110 SE[1]
application focus—process development applications[1]
process capability—deep silicon plasma etching[1]
capabilities—very high aspect ratio trench etch and profile control[1]
configuration—multiple configurations with minimum technical intervention[1]
System type—plasma etch system[4]
Supported components—MEMS and 3D-IC components[1]
Control capability—very high aspect ratio trench etch and profile control[4]
Physical description—compact[1]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]inventory listing
  3. [3]Equipment inventory listing
  4. [4]waferpedia.comwaferpedia.com