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Alliance A 6 TCP 9400 DFM Polysiliconversus100 ICP Fluorine

Lam Research Alliance A 6 TCP 9400 DFM Polysilicon, Oxford Instruments 100 ICP Fluorine, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
100 ICP FluorineOxford Instruments
OEMLam ResearchOxford Instruments
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLam Research Alliance A 6 TCP 9400 DFM PolysiliconOxford Instruments 100 ICP Fluorine
Specifications
Wafer Size8 inch[1]—
Voltage208 VAC[2]—
Frequency50/60 Hz[2]—
Full Load Current43 A[2]—
Short Circuit Interrupting Capacity10 kA[2]—
Main Circuit Breaker Rating50 A[2]—
Software VersionA4.0-37VM[1]—
ESC MaterialAnodized Aluminum[1]—
Interferometer EPPM4[1]—
Gas BoxEnhanced Universal (12 sticks)[1]—
PumpsBusch DS 80 Cobra, Busch BA 100 (2)[1]—
ChillersTCU Edwards 40/80 Plus, RPM Voltage SAG Enhanced[1]—
Transport ModuleTCP 9400 FM-P (Tungsten Silicide Etch)[1]—
SoftwareA4.0-37VM[1]—
PM4TCP 9400D FM-P, Wsix Etch[1]—
ESCAnodized Aluminum[1]—
TCUEdwards 40/80 Plus[1]—
RPMVoltage SAG Enhanced[1]—
Main CB Current Rating50 A[2]—
OEMLam[1]—
ModelAlliance A 6 TCP 9400 DFM[1]—
ProcessPolysilicon etch[1]—
Transport moduleTCP 9400 FM-P[1]—
Enhanced Universal Gas Box12 sticks[1]—
PM4 Gas BoxBrooks GF 125 (10)[1]—
Dry pumpsBusch DS 80 Cobra[1]—
Chiller TCUEdwards 40/80 Plus[1]—
Etch Gases—SF6, CF4, O2, Ar, N2, CHF3, C4F8[3]
Cryo DRIE etch rate—up to 5 µm/min[3]
Wafer size—4 inch, 6 inch, 8 inch (with clamp change)[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing
  3. [3]nanofab.utah.edunanofab.utah.edu