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Comparison ledger

Rainbow 9600 SE II TCPversus100 ICP Fluorine

Lam Research Rainbow 9600 SE II TCP, Oxford Instruments 100 ICP Fluorine, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
100 ICP FluorineOxford Instruments
OEMLam ResearchOxford Instruments
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLam Research RainbowOxford Instruments 100 ICP Fluorine
Specifications
ConfigurationWith DSQ[1]—
Wafer TypeFlat[1]—
Vlave TypeVAT Pendulum Valve 65 Series[2]—
SMIFNo[2]—
BulkheadWall Facia are Missing[2]—
Monochromator EndpointDual Endpoint Detector - Lam # 853 001983 110[2]—
SoftwareE 2.0.1-044[2]—
RF3X on Board Trumpf Generators (Top, Bias, DSQ)[2]—
CartNo[2]—
Robot TypeHarmonic Drive[2]—
Loader TypeHine Indexers 38 A[2]—
Turbo PumpsAlcatel ATH 1300 MT[2]—
OEMLam Research[2]—
ModelRainbow 9600 SE II TCP[2]—
CategoryEtch[1]—
Equipment typePlasma etcher[2]—
Wafer size6 inch[2]4 inch, 6 inch, 8 inch (with clamp change)[3]
Turbo pump configurationAdixen Magpower (Turbo Pump)[2]—
EndpointDual Endpoint Detector[2]—
Convertible sizeConvertible to 8"[2]—
Valve typeVAT Pendulum Valve 65 Series[2]—
ESCCoated Aluminum ESC - Lam # 718 094756 061[2]—
Etch architectureInductively coupled plasma (TCP)[1]—
DSQWith DSQ[2]—
Endpoint detectionDual endpoint detector[2]—
Endpoint opticsMonochromator[2]—
Turbo pump controllerAdixen Magpower[2]—
Temperature controller12 CH Anafaze Temp Controller[2]—
Throttle valve controllerAC 2 Controller[2]—
Pendulum valve controllerVAT PM 7 Controller[2]—
Manual WVDS controllerPresent[2]—
Etch Gases—SF6, CF4, O2, Ar, N2, CHF3, C4F8[3]
Cryo DRIE etch rate—up to 5 µm/min[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing
  3. [3]nanofab.utah.edunanofab.utah.edu