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Comparison ledger

120 Continuousversus6 DS SP

Lapmaster 120 Continuous, Strasbaugh 6 DS SP, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
6 DS SPStrasbaugh
OEMLapmasterStrasbaugh
CategoryCMPCMP
Wafer size—Single Wafer SiC Substrate
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLapmaster 120 ContinuousStrasbaugh 6 DS SP
Specifications
Configuration—Multi Process[1]
Voltage—208 V, 3 Phase, 60 Hz[2]
Full Load—60 A[2]
Motor—36 A[2]
Interrupting Capacity—10,000 A[2]
Wafer size—Single Wafer SiC Substrate[2]
Make—Strasbaugh[1]
Model—6 DS SP[1]
Equipment type—CMP (Chemical Mechanical Polisher)[1]
Wafer sizes—8 inch[1]
Operating voltage—208 V[2]
Phase—3 Phase[2]
Frequency—60 Hz[2]
Full load current—60 A[2]
Motor current—36 A[2]
Automation—Fully automated[2]
Material—Single Wafer SiC Substrate[2]
Wafer carriers—2 x 150 mm wafer carriers; 1 x 150 mm wafer carriers[2]
Carrier rebuild kit—Acid resistance carrier rebuild kit[2]
Temperature control—Table temperature control unit (SMC chiller)[2]
Loading—Two cassette slots for loading[2]
Unloading—Two cassette slots for unloading[2]
Polish mode—Single sided polish[2]
Polish modules—1 polish module equipped with dedicated hardware[2]
Pad conditioning—Programmable pad conditioning[2]
Spindle—Overam spindle with 4 passage rotary union[2]
Slurry dosing—Slurry perilstatic pump dosing on the table[2]
Vacuum—Universal vacuum pump[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing