Lapmaster
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During CMP, a wafer is pressed against a rotating platen covered with a polishing pad. A chemical slurry is dispensed onto the pad. The combined chemical and mechanical action removes material to achieve planarization.
CMP is applied in shallow trench isolation (STI), interlayer dielectric (ILD) planarization, and copper damascene processes.
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The following facts about the 120 Continuous are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the 120 Continuous are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 120 Continuous are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 120 Continuous are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 120 Continuous are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 120 Continuous are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
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Last updated Sep 1, 2026.
The Logitech 1 DP 41 is a polisher with 3-phase, 50/60 Hz, 480 V, 12 amp electrical requirements.
The Lapmaster 15 Lapper is a lapping machine with a 15-inch outside plate diameter and a 1/2 HP drive motor.