Waferpedia

Comparison ledger

15versusMWS 610

Lapmaster 15, Takatori MWS 610, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
15Lapmaster
MWS 610Takatori
OEMLapmasterTakatori
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLapmaster 15Takatori MWS 610
Cited variants—
Specifications
Input Power110 Vac[2]—
Plate Diameter15 inches (381 mm)[3]—
Number of Conditioning Rings3[3]—
Ring ID5.5 inches (140 mm)[3]—
Standard RPM60[3]—
RPM Range (Variable Speed Drive)0-60[3]—
Drive Motor - Lapper0.5 HP (0.37 kW)[3]—
Drive Motor - Polisher0.75 HP (0.56 kW)[3]—
Length25 inches (635 mm)[3]—
Width20 inches (508 mm)[3]—
Height24 inches (610 mm)[3]—
Estimated Shipping Weight285 lbs (129.3 kg)[3]—
Manufacturer—Takatori[4]
Model—MWS 610[4]
Machine type—Wire saw[5]
Category—Dicing & Grinding[5]
Application—Dicing and grinding[5]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing
  3. [3]web.archive.orgweb.archive.org
  4. [4]Equipment inventory listing
  5. [5]waferpedia.comwaferpedia.com
  6. [6]used-machines.comused-machines.com