Waferpedia

Takatori

MWS 610

Dicing & GrindingTakatori MWS 610 family
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Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The Takatori MWS 610 is a wire saw for dicing and grinding. The Takatori MWS 610 is a multi wire saw. The Takatori MWS 610 is in the Dicing & Grinding category.[1][2][3]

MWS 610 — Inventory photo
Fig. 01MWS 610Inventory photo[4]

What it is

The Takatori MWS 610 is a wire saw. The Takatori MWS 610 is categorized for dicing and grinding.[4][1][3]

How it works

General reference — not yet source-verified

Wire saws remove material by moving a tensioned wire through a workpiece while abrasive action performs the cut. Wire saw systems generally combine controlled wire motion, work handling, and process-fluid delivery to support stable cutting through brittle materials.

Where it fits in the process flow

General reference — not yet source-verified

Wire saws sit in the material separation and shaping portion of manufacturing rather than in lithography, deposition, or electrical test. Wire saw processing is typically used after bulk material preparation and before later assembly or device finishing steps that require smaller or further-shaped pieces.

Applications

General reference — not yet source-verified

Wire saws are used for dicing, slicing, and shaping hard or brittle materials in semiconductor and related precision-material workflows. Wire saw processing is applied where narrow cuts and controlled mechanical removal are needed for wafers, substrates, crystals, or similar workpieces.

What do the numbers mean?

Configuration & options6

Manufacturer
Takatori[4]
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Model
MWS 610[4]
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Machine type
Wire saw[1]
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Category
Dicing & Grinding[1]
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Application
Dicing and grinding[1]
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Machine type
Multi wire saw[2]
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Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
MWS 610 SD—2017Wire saw for dicing applications.waferpedia.com[3]
MWS 610 SN———waferpedia.com[3]
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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What kind of machine is the Takatori MWS 610?

The Takatori MWS 610 is a wire saw.[4][1][3]

Not publicly documented

The following facts about the MWS 610 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MWS 610 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the MWS 610 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the MWS 610 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the MWS 610 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the MWS 610 are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]waferpedia.com — waferpedia.comwaferpedia.com
  2. [2]used-machines.com — used-machines.comused-machines.com
  3. [3]waferpedia.com — waferpedia.comwaferpedia.com
  4. [4]Inventory photo
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Last updated Oct 15, 2026.

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