Comparison ledger
Logitech 1 WBS 1 Wafer Substrate, Nordson 4000 PXY, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1 WBS 1 Wafer SubstrateLogitech | 4000 PXYNordson |
|---|---|---|
| OEM | Logitech | Nordson |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Logitech 1 WBS 1 Wafer Substrate | Nordson 4000 |
| Specifications | ||
| Wafer Size | 6 inch[1] | — |
| Configuration | — | Cold Bump Pull[2] |
| Make | — | Nordson / Dage[2] |
| Model | — | 4000 PXY[2] |
| Product type | — | Tester[3] |
| Category | — | Test & Probe[3] |
| Power | — | Single phase[3] |
| Frequency | — | 50/60 Hz[3] |
| Voltage | — | 110 V / 230 V[3] |
| Power rating | — | 250 VA[3] |
| Equipment type | — | Pull & Shear Tester[4] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →