Comparison ledger
Logitech 1 WBS 1 Wafer Substrate, West Bond 353637 E 90, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1 WBS 1 Wafer SubstrateLogitech | 353637 E 90West Bond |
|---|---|---|
| OEM | Logitech | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Logitech 1 WBS 1 Wafer Substrate | West Bond 353637 E 90 |
| Specifications | ||
| Wafer Size | 6 inch[1] | — |
| Bonding Area | — | 5.375" × 9.5" (5 3/8" × 9 1/2")[2] |
| Configuration | — | 2400B Series software[2] |
| Equipment type | — | Wire bonder[3] |
| Software | — | 2400B Series software[2] |
| Bonding mode | — | Currently configured for wedge bonding[4] |
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