West Bond
353637 E 90
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The West Bond 353637 E 90 is a wire bonder. The West Bond 353637 E 90 has a bonding area of 5.375" × 9.5". The West Bond 353637 E 90 uses 2400B Series software.[1][2]
What it is
How it works
General reference — not yet source-verifiedWire bonders make electrical connections by attaching fine wire between device bond pads and package or substrate connection points. Wire bonders are used after device fabrication and singulation or substrate preparation, when an assembled part needs interconnection to complete the electrical path. Wire bonding can be carried out with different bonding methods depending on the bond head, wire material, and package geometry.
Where it fits in the process flow
General reference — not yet source-verifiedPackaging and bonding tools sit in the assembly portion of semiconductor manufacturing rather than in front-end wafer patterning. Wire bonders are used after a die or device has been placed into a package, onto a substrate, or onto another carrier that exposes connection points for interconnect. Wire bonding is followed by later assembly operations such as encapsulation, lid attach, inspection, and electrical test, depending on the product flow.
Applications
The West Bond 353637E-90 is intended to bond groups of parallel wires on work pieces pre-aligned for front-to-back bonding. The West Bond 353637E-90 accepts aluminum wire in wedge-wedge bonding, and the same method also accepts gold wire with work piece heat. The West Bond 353637E-90 can be converted from angled-clamp wire feed to vertical-feed wedge bonding for deep-walled work packages.[3]
What do the numbers mean?
Control & software2
- 2400B Series software[1]
Configuration & options4
- Automatic, gantry, large area, triple-convertible wire bonder[3]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the 353637 E 90 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 353637 E 90 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 353637 E 90 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 353637 E 90 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 353637 E 90 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 353637 E 90 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]waferpedia.com — waferpedia.comwaferpedia.com
- [3]tarasemi.com — tarasemi.comtarasemi.com
Last updated Oct 16, 2026.
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