Comparison ledger
Logitech 1 WBS 1 Wafer Substrate, West Bond 4 KE, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1 WBS 1 Wafer SubstrateLogitech | 4 KEWest Bond |
|---|---|---|
| OEM | Logitech | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Logitech 1 WBS 1 Wafer Substrate | West Bond 4 KE |
| Specifications | ||
| Wafer Size | 6 inch[1] | — |
| Bond Force Range | — | 10 – 150 grams[2] |
| Voltage | — | 115V, 50/60Hz, 3.2A[2] |
| Machine type | — | Wire bonder[3] |
| Electrical requirements | — | 115V, 50/60Hz, 3.2A[2] |
| Machine family | — | 4KE / 4KEH[4] |
| Bonder type | — | Multi-Loop, Multi Wire, Wedge / Ball / Ribbon Wire Bonder[4] |
| Axes | — | Motorized Z and Y Axes[4] |
| Convertible modes | — | 3-Way Convertible[4] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →