Comparison ledger
LPKF Contac S 4 Through Hole Electroplating, Semitool 003163-000 SRD, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 003163-000 SRDSemitool | |
|---|---|---|
| OEM | LPKF | Semitool |
| Category | Wet Processing / Clean | Wet Processing / Clean |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | LPKF Contac S 4 Through Hole Electroplating | Semitool 003163-000 SRD |
| Specifications | ||
| Make | LPKF[1] | Semitool[6] |
| Model | Contac S 4[1] | 003163-000[6] |
| Equipment type | Through-hole electroplating equipment[2] | Spin Rinse Dryer (SRD)[6] |
| Intended use | Through-hole plating of double-sided and multi-layer PCBs and galvanic strengthening of copper surfaces[3] | — |
| Tin plating | PCBs can be tin-plated after copper build-up is completed[3] | — |
| Maximum layers | Up to eight layers[4] | — |
| Maximum aspect ratio | 1:10 (hole diameter to PCB thickness)[4] | — |
| Minimum hole diameter | At least 0.2 mm[3] | — |
| Maximum material size (X x Y) | 230 mm x 330 mm[5] | — |
| Maximum layout area (X x Y) | 200 mm x 300 mm[5] | — |
| Reverse pulse plating | Included[5] | — |
| ViaCleaner | Included[5] | — |
| Chemical tinning | Included[5] | — |
| Process time | Approximately 90–120 min[5] | — |
| Electrical consumption | 115/230 V, 50–60 Hz, 0.6 kW[5] | — |
| Dimensions (W x H x D) | 856 mm x 446 mm x 542 mm[5] | — |
| Weight | ~ 80 kg unfilled, ~ 115 kg filled[5] | — |
| Asset # | — | 139375[6] |
| Last Confirm Date | — | September 03, 2025[6] |
Plan your fab
Building a Wet Processing / Clean process? Get a complete equipment list.
Open the fab equipment planner →