LPKF
Contac S 4 Through Hole Electroplating
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
LPKF Contac S 4 Through Hole Electroplating is a through-hole electroplating system for printed circuit board manufacturing. LPKF Contac S 4 Through Hole Electroplating is used for through-hole plating of double-sided and multi-layer PCBs. LPKF Contac S 4 Through Hole Electroplating supports galvanic strengthening of copper surfaces.[1][2]
How it works
The LPKF Contac S4 uses six baths and routes the board through a bath cascade. The LPKF Contac S4 uses reverse pulse plating for copper buildup. The LPKF Contac S4 includes carbon activation using black hole technology, integrated air blow-in, and an additional via-cleaning step. The LPKF Contac S4 offers a subsequent tin bath step for surface protection and improved solderability. The LPKF Contac S4 uses an integrated touch control panel with assistant or wizard functions and parameter management.[4][5]
Where it fits in the process flow
The LPKF Contac S4 is used for interconnection of two or more layers in PCB prototyping. The LPKF Contac S4 produces copper layers on the walls of through-holes and vias, including in multilayer boards. The LPKF Contac S4 can process up to eight layers with a maximum aspect ratio of 1:10. The LPKF Contac S4 offers a final tin bath for surface protection and improved solderability.[4][5]
Applications
The LPKF Contac S4 is intended for demanding PCB prototypes and development-lab through-hole plating. The LPKF Contac S4 is used on double-sided and multilayer PCBs. The LPKF Contac S4 supports homogeneous copper layer buildup on hole walls and flat metal surfaces. The LPKF Contac S4 includes microvia or via cleaning and chemical tinning functions.[4][5]
What do the numbers mean?
Power & electrical1
Gas & chemistry1
Dimensions & facilities2
Configuration & options13
- Intended use
- Through-hole plating of double-sided and multi-layer PCBs and galvanic strengthening of copper surfaces[2]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What kind of equipment is the LPKF Contac S4?
The LPKF Contac S4 is a through-hole electroplating system for printed circuit board manufacturing and PCB prototyping.[1][4]
What board size can the LPKF Contac S4 process?
The LPKF Contac S4 has a maximum material size of 230 mm x 330 mm and a maximum layout area of 200 mm x 300 mm.[5]
What hole size and copper-coating tolerance are specified for the LPKF Contac S4?
The LPKF Contac S4 specifies a minimum hole diameter of at least 0.2 mm and a copper-coating tolerance of ± 2 μm.[5]
How long does a process run take on the LPKF Contac S4?
The LPKF Contac S4 specifies a process time of approximately 90 to 120 minutes.[5]
What utilities and physical dimensions are specified for the LPKF Contac S4?
The LPKF Contac S4 specifies 115/230 V, 50 to 60 Hz, and 0.6 kW electrical consumption. The LPKF Contac S4 specifies dimensions of 856 mm x 446 mm x 542 mm and a weight of about 80 kg unfilled and about 115 kg filled.[5]
Not publicly documented
The following facts about the Contac S 4 Through Hole Electroplating are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Contac S 4 Through Hole Electroplating are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Contac S 4 Through Hole Electroplating are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Contac S 4 Through Hole Electroplating are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Contac S 4 Through Hole Electroplating are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Contac S 4 Through Hole Electroplating is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]waferpedia.com — waferpedia.comwaferpedia.com
- [2]wiki.nanofab.usc.edu — wiki.nanofab.usc.eduwiki.nanofab.usc.edu
- [3]Equipment inventory listing
- [4]lpkf.com — lpkf.comlpkf.com
- [5]lpkf.cn — lpkf.cnlpkf.cn
Last updated Oct 20, 2026.
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