Comparison ledger
Meyer Burger AK 800, Tegal 110, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | AK 800Meyer Burger | 110Tegal |
|---|---|---|
| OEM | Meyer Burger | Tegal |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Meyer Burger AK 800 | Tegal 110 |
| Cited variants | — |
|
| Specifications | ||
| 1. Magnetron head | Muegge 3kW | — |
| 8. Gas box | BCl3, Cl2, C4F8, CF4, CF3H, | — |
| 19. Dry pump | Ebara EV-S100P | — |
| 20. Dry Pump | Ebara EV-M202N- | — |
| Vintage | 2015 | — |
| Etch/Asher Vintage | 2015 | — |
| model | — | 110 SE[1] |
| application focus | — | process development applications[1] |
| process capability | — | deep silicon plasma etching[1] |
| capabilities | — | very high aspect ratio trench etch and profile control[1] |
| configuration | — | multiple configurations with minimum technical intervention[1] |
| System type | — | plasma etch system[2] |
| Supported components | — | MEMS and 3D-IC components[1] |
| Control capability | — | very high aspect ratio trench etch and profile control[2] |
| Physical description | — | compact[1] |
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