Comparison ledger
MPI TS150, Rorze 03 RR 8120-001-001 Wafer Exchanger, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | TS150MPI | |
|---|---|---|
| OEM | MPI | Rorze |
| Category | Test & Probe | Test & Probe |
| Wafer size | 6" | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | MPI TS150 | Rorze 03 RR 8120-001-001 Wafer Exchanger |
| Specifications | ||
| Maximum independent terminals | 4 independent terminals plus additional chuck grounding[1] | — |
| Wafer size compatibility | up to 6 inch[1] | — |
| Chuck stage | Fine-glide chuck stage on highly stable granite base[1] | — |
| X-Y travel range | 150 mm x 150 mm coarse and 10 mm x 10 mm fine[1] | — |
| Optics | Binocular optics with oculars or microscope view on monitor[1] | — |
| Illumination | Selectable 4 quadrants LED illumination[1] | — |
| Probe positioners | True X,Y,Z micro-positioners (MPI PM100)[1] | — |
| Probe tips | Interchangeable tungsten contact tips; two different diameters available[1] | — |
| Measurement capability | Designed for electrical testing on wafers or chips[1] | — |
| Maximum terminals | 4 independent terminals + additional chuck grounding[1] | — |
| Chuck compatibility | wafer sizes up to 6 inch, chip or part of wafers[1] | — |
| Stage type | Fine-glide chuck stage on highly stable granite base[1] | — |
| X-Y travel range (coarse) | 150mm x 150mm[1] | — |
| X-Y travel range (fine) | 10mm x 10mm[1] | — |
| Probe micro-positioners | MPI PM100 true X,Y,Z micro-positioners with interchangeable tungsten (W) contact tips (two different diameter available)[1] | — |
| Additional electrical connection | to the chuck for conductive substrates[1] | — |
| DC measurement unit | Agilent 4155C Semiconductor Parameter Analyzer with 4x Medium-power SMU, 2xVSU and 2xVMU[1] | — |
| DC voltage and current capability | +/- 40 Volts and +/- 100 mA measurement unit (SMU)[1] | — |
| DC measurement resolution | 10 femtoamp and 0.2 microvolt[1] | — |
| Switching box configurations | 6 configuration options for standard applications such as FET, bipolar transistors, diodes, 2-points and 4-points general measurements[1] | — |
| DC software | Desktop EasyEXPERT software for PC-based GUI instrument control[1] | — |
| AC measurement unit | Zürich Instruments MFIA multi-frequency impedance analyzer[1] | — |
| AC signal frequency | DC to 5 MHz[1] | — |
| AC signal voltage | 0 to 2.1 V RMS[1] | — |
| DC bias (2 probes) | +/- 10 Volts[1] | — |
| DC bias (4 probes) | +/- 3 Volts[1] | — |
| Impedance range | 1 mOhm to 1 TOhm[1] | — |
| AC test fixture | MFITF can be mounted on the MFIA for rapid testing of wire-bonded surface-mounted devices[1] | — |
| AC software | LabOne software for PC-based GUI instrument control[1] | — |
| Maximum wafer size compatibility | up to 6 inch[1] | — |
| Number of independent terminals | maximum 4 plus additional chuck grounding[1] | — |
| DC voltage range | +/-40 Volts[1] | — |
| DC current range | +/-100 mA[1] | — |
| SMU measurement resolution | 10 femtoamp and 0.2 microvolt[1] | — |
| AC signal frequency range | DC to 5 MHz[1] | — |
| AC signal voltage range | 0 to 2.1 V RMS[1] | — |
| DC bias range (2 probes) | +/-10 Volts[1] | — |
| DC bias range (4 probes) | +/-3 Volts[1] | — |
| Impedance range (AC) | 1 mOhm to 1 TOhm[1] | — |
| Probe micro-positioner model | MPI PM100[1] | — |
| Probe tip material | tungsten carbide (W)[1] | — |
| Type | Probe station[1] | — |
| Use | Electrical testing on wafers or chips[1] | — |
| Maximum wafer size | up to 6 inch[1] | — |
| Independent terminals | maximum of 4 independent terminals + additional chuck grounding[1] | — |
| Probe positioning | Three-axis movement of the probe tips with manual micro-manipulators[1] | — |
| Chuck travel range | 150 mm x 150 mm coarse and 10 mm x 10 mm fine X-Y travel range[1] | — |
| Max independent terminals | 4 plus additional chuck grounding[1] | — |
| DC measurement voltage | +/- 40 Volts[1] | — |
| DC measurement current | +/- 100 mA[1] | — |
| DC measurement resolution (current) | 10 femtoamp[1] | — |
| DC measurement resolution (voltage) | 0.2 microvolt[1] | — |
| AC DC bias (2 probes) | +/- 10 Volts[1] | — |
| AC DC bias (4 probes) | +/- 3 Volts[1] | — |
| Primary use | Electrical testing on wafers or chips[1] | — |
| Supported wafer size | Up to 6 inch[1] | — |
| Supported substrate description | Precise analytical probing of substrates and 150 mm wafers[2] | — |
| Chuck stage travel range | 180 x 230 mm[2] | — |
| Chuck fine-travel range | 25 x 25 mm fine micrometer control[2] | — |
| Probe platen capacity | Up to 10 DC or 4 RF MicroPositioners[2] | — |
| Platen lift positions | Contact (0), separation (300 μm), and loading (3 mm)[2] | — |
| Standard wafer chuck supported DUT size | Single DUTs down to 5 x 5 mm or wafers 50 mm through 150 mm[2] | — |
| Wafer size | — | 8 inch[3] |
| Manufacturer | — | Rorze[3] |
| Model | — | 03 RR 8120-001-001[3] |
| Equipment type | — | Wafer Exchanger[3] |
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