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MPI

TS150

Test & Probe6"MPI TS150 family
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The MPI TS150 is a probe station designed for electrical testing on wafers or chips. The MPI TS150 supports a maximum of 4 independent terminals plus additional chuck grounding. The MPI TS150 is coupled to an Agilent 4155C Semiconductor Parameter Analyzer for DC characterization and a Zürich Instruments MFIA for AC characterization.[1]

MPITS150
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  • Plate 01TS150 200 Probe System Overview. (Обзор зондовых станций TS150 и TS200)

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Wafer size

6"

Power

to the chuck for conductive substrates[1]

Optics

Selectable 4 quadrants LED illumination[1]

What it is

The MPI TS150 is a manual probe system for precise analytical probing of substrates and 150 mm wafers. The MPI TS150 is designed for electrical testing on wafers or chips with a maximum of 4 independent terminals plus additional chuck grounding. The MPI TS150 may be configured to support a wide variety of on-wafer applications. The EPFL installation combines the MPI TS150 probe station with an Agilent 4155C Semiconductor Parameter Analyzer for DC characterization and a Zürich Instruments MFIA for AC characterization.[3][1]

How it works

The MPI TS150 uses a wafer chuck, a chuck XYT stage, a probe platen, microscope movement, and MPI micropositioners as part of its probe system architecture. The MPI TS150 uses binocular optics with a digital camera to center probe tips on contact pads. The MPI TS150 uses manual micro-manipulators with three-axis probe-tip movement to make soft and precise mechanical contact on pads. The EPFL installation includes MPI PM100 true X,Y,Z micro-positioners with interchangeable tungsten contact tips. The EPFL installation includes a fine-glide chuck stage on a highly stable granite base with 150 mm x 150 mm and 10 mm x 10 mm coarse and fine X-Y travel range.[3][1]

The EPFL installation supports wafers up to 6 inch as well as chips or parts of wafers. The EPFL installation includes selectable 4 quadrant LED illumination and microscope viewing through oculars or on a monitor. The EPFL installation provides an additional electrical connection to the chuck for conductive substrates. The Agilent 4155C configuration at EPFL provides 4 medium-power SMUs, 2 VSUs, and 2 VMUs. The Agilent 4155C configuration at EPFL supports measurement capabilities of +/- 40 V and +/- 100 mA on the SMU with 10 fA and 0.2 microvolt measurement resolution. The MFIA configuration at EPFL supports AC signal frequency from DC to 5 MHz, AC signal voltage from 0 to 2.1 V RMS, DC bias of +/- 10 V with 2 probes and +/- 3 V with 4 probes, and impedance range from 1 mOhm to 1 TOhm.[1]

Where it fits in the process flow

General reference — not yet source-verified

Probe stations are used after fabrication has produced accessible pads or terminals on a wafer or die and before or instead of permanent package assembly. Probe testing fits into characterization, verification, failure analysis, and process monitoring workflows where direct electrical access to on-wafer structures is needed.

Applications

The EPFL installation is used to perform DC characterization of microelectronic devices under test such as resistance structures, diodes, and transistors. The EPFL installation is also used for AC characterization with a multi-frequency impedance analyzer. The EPFL installation includes 6 switching-box configuration options for standard applications such as FETs, bipolar transistors, diodes, and 2-point and 4-point general measurements.[1]

  • Electrical testing on wafers
  • Electrical testing on chips
  • DC characterization of microelectronic devices
  • AC characterization of devices under test
  • Resistance measurements
  • Diode measurements
  • Transistor measurements
  • 2-point measurements
  • 4-point measurements

Why won't it start?

Documented failure modes, common issues, and field considerations.

  • The source warns of shock hazard during measurement.
  • The source states probe needles have very sharp tungsten carbide tips and can be damaged by crash or contamination.
  • The source warns not to use the probes for mechanical testing or machining.

What do the numbers mean?

Power & electrical19

Measurement capability
Designed for electrical testing on wafers or chips[1]
Accurate?
Additional electrical connection
to the chuck for conductive substrates[1]
Accurate?
DC voltage and current capability
+/- 40 Volts and +/- 100 mA measurement unit (SMU)[1]
Accurate?
AC signal frequency
DC to 5 MHz[1]
Accurate?
AC signal voltage
0 to 2.1 V RMS[1]
Accurate?
DC bias (2 probes)
+/- 10 Volts[1]
Accurate?
DC bias (4 probes)
+/- 3 Volts[1]
Accurate?
DC voltage range
+/-40 Volts[1]
Accurate?
AC signal frequency range
DC to 5 MHz[1]
Accurate?
AC signal voltage range
0 to 2.1 V RMS[1]
Accurate?
DC bias range (2 probes)
+/-10 Volts[1]
Accurate?
DC bias range (4 probes)
+/-3 Volts[1]
Accurate?
Use
Electrical testing on wafers or chips[1]
Accurate?
DC measurement voltage
+/- 40 Volts[1]
Accurate?
DC measurement resolution (voltage)
0.2 microvolt[1]
Accurate?
AC DC bias (2 probes)
+/- 10 Volts[1]
Accurate?
AC DC bias (4 probes)
+/- 3 Volts[1]
Accurate?
Primary use
Electrical testing on wafers or chips[1]
Accurate?
Probe platen capacity
Up to 10 DC or 4 RF MicroPositioners[2]
Accurate?

Wafer handling17

Maximum independent terminals
4 independent terminals plus additional chuck grounding[1]
Accurate?
Wafer size compatibility
up to 6 inch[1]
Accurate?
Chuck stage
Fine-glide chuck stage on highly stable granite base[1]
Accurate?
Maximum terminals
4 independent terminals + additional chuck grounding[1]
Accurate?
Chuck compatibility
wafer sizes up to 6 inch, chip or part of wafers[1]
Accurate?
Stage type
Fine-glide chuck stage on highly stable granite base[1]
Accurate?
Maximum wafer size compatibility
up to 6 inch[1]
Accurate?
Number of independent terminals
maximum 4 plus additional chuck grounding[1]
Accurate?
Maximum wafer size
up to 6 inch[1]
Accurate?
Independent terminals
maximum of 4 independent terminals + additional chuck grounding[1]
Accurate?
Chuck travel range
150 mm x 150 mm coarse and 10 mm x 10 mm fine X-Y travel range[1]
Accurate?
Max independent terminals
4 plus additional chuck grounding[1]
Accurate?
Supported wafer size
Up to 6 inch[1]
Accurate?
Supported substrate description
Precise analytical probing of substrates and 150 mm wafers[2]
Accurate?
Chuck stage travel range
180 x 230 mm[2]
Accurate?
Chuck fine-travel range
25 x 25 mm fine micrometer control[2]
Accurate?
Standard wafer chuck supported DUT size
Single DUTs down to 5 x 5 mm or wafers 50 mm through 150 mm[2]
Accurate?

Optics & imaging8

Optics
Binocular optics with oculars or microscope view on monitor[1]
Accurate?
Illumination
Selectable 4 quadrants LED illumination[1]
Accurate?
Optics
Binocular optics with occulars or microscope view on monitor, single objective with zoom option, selectable 4 quadrants LED illumination[1]
Accurate?
DC measurement resolution
10 femtoamp and 0.2 microvolt[1]
Accurate?
SMU measurement resolution
10 femtoamp and 0.2 microvolt[1]
Accurate?
Optics
binocular optics with digital camera and monitor display, selectable 4 quadrant LED illumination[1]
Accurate?
Optics
Binocular optics with digital camera[1]
Accurate?
DC measurement resolution (current)
10 femtoamp[1]
Accurate?

Control & software2

DC software
Desktop EasyEXPERT software for PC-based GUI instrument control[1]
Accurate?
AC software
LabOne software for PC-based GUI instrument control[1]
Accurate?

Configuration & options21

X-Y travel range
150 mm x 150 mm coarse and 10 mm x 10 mm fine[1]
Accurate?
Probe positioners
True X,Y,Z micro-positioners (MPI PM100)[1]
Accurate?
Probe tips
Interchangeable tungsten contact tips; two different diameters available[1]
Accurate?
X-Y travel range (coarse)
150mm x 150mm[1]
Accurate?
X-Y travel range (fine)
10mm x 10mm[1]
Accurate?
Probe micro-positioners
MPI PM100 true X,Y,Z micro-positioners with interchangeable tungsten (W) contact tips (two different diameter available)[1]
Accurate?
DC measurement unit
Agilent 4155C Semiconductor Parameter Analyzer with 4x Medium-power SMU, 2xVSU and 2xVMU[1]
Accurate?
Switching box configurations
6 configuration options for standard applications such as FET, bipolar transistors, diodes, 2-points and 4-points general measurements[1]
Accurate?
AC measurement unit
Zürich Instruments MFIA multi-frequency impedance analyzer[1]
Accurate?
Impedance range
1 mOhm to 1 TOhm[1]
Accurate?
AC test fixture
MFITF can be mounted on the MFIA for rapid testing of wire-bonded surface-mounted devices[1]
Accurate?
DC current range
+/-100 mA[1]
Accurate?
Impedance range (AC)
1 mOhm to 1 TOhm[1]
Accurate?
Probe micro-positioner model
MPI PM100[1]
Accurate?
Probe tip material
tungsten carbide (W)[1]
Accurate?
Type
Probe station[1]
Accurate?
Probe positioning
Three-axis movement of the probe tips with manual micro-manipulators[1]
Accurate?
Probe tips
Interchangeable tungsten contact tips[1]
Accurate?
DC measurement current
+/- 100 mA[1]
Accurate?
Type
Manual probe station / manual probe system[1]
Accurate?
Platen lift positions
Contact (0), separation (300 μm), and loading (3 mm)[2]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Measurement capabilityDesigned for electrical testing on wafers or chips[1]
  • Additional electrical connectionto the chuck for conductive substrates[1]
  • DC voltage and current capability+/- 40 Volts and +/- 100 mA measurement unit (SMU)[1]
  • AC signal frequencyDC to 5 MHz[1]
  • AC signal voltage0 to 2.1 V RMS[1]
  • DC bias (2 probes)+/- 10 Volts[1]
  • DC bias (4 probes)+/- 3 Volts[1]
  • DC voltage range+/-40 Volts[1]
  • AC signal frequency rangeDC to 5 MHz[1]
  • AC signal voltage range0 to 2.1 V RMS[1]
  • DC bias range (2 probes)+/-10 Volts[1]
  • DC bias range (4 probes)+/-3 Volts[1]
  • UseElectrical testing on wafers or chips[1]
  • DC measurement voltage+/- 40 Volts[1]
  • DC measurement resolution (voltage)0.2 microvolt[1]
  • AC DC bias (2 probes)+/- 10 Volts[1]
  • AC DC bias (4 probes)+/- 3 Volts[1]
  • Primary useElectrical testing on wafers or chips[1]
  • Probe platen capacityUp to 10 DC or 4 RF MicroPositioners[2]

Where are the manuals?

Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What sample formats can the MPI TS150 handle in the EPFL configuration?

The EPFL configuration has a chuck compatible with wafer sizes up to 6 inch, chips, or parts of wafers.[1]

How many electrical terminals are available on the MPI TS150 in the EPFL setup?

The EPFL setup is designed for electrical testing with a maximum of 4 independent terminals plus additional chuck grounding.[1]

What measurement instruments are coupled to the MPI TS150 at EPFL?

The EPFL setup is coupled to an Agilent 4155C Semiconductor Parameter Analyzer for DC characterization and a Zürich Instruments MFIA for AC characterization.[1]

Not publicly documented

The following facts about the TS150 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the TS150 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the TS150 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the TS150 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • The process node or technology generation of the TS150 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the TS150 are on record.

    Answerable by: an OEM parts catalog or a service engineer

Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]epfl.ch — epfl.chepfl.ch
  2. [2]mpi.com.twmpi.com.tw
  3. [3]https://mpt.eecs.yorku.ca/wp-content/uploads/2019/10/TS150-USER-MANUAL-Rev-2.1.3_20171020.pdf — mpt.eecs.yorku.campt.eecs.yorku.ca
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Last updated Oct 19, 2026.

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