MPI
The MPI TS150 is a probe station designed for electrical testing on wafers or chips. The MPI TS150 supports a maximum of 4 independent terminals plus additional chuck grounding. The MPI TS150 is coupled to an Agilent 4155C Semiconductor Parameter Analyzer for DC characterization and a Zürich Instruments MFIA for AC characterization.[1]
Plate 01TS150 200 Probe System Overview. (Обзор зондовых станций TS150 и TS200)
Wafer size
6"
Power
to the chuck for conductive substrates[1]
Optics
Selectable 4 quadrants LED illumination[1]
The MPI TS150 is a manual probe system for precise analytical probing of substrates and 150 mm wafers. The MPI TS150 is designed for electrical testing on wafers or chips with a maximum of 4 independent terminals plus additional chuck grounding. The MPI TS150 may be configured to support a wide variety of on-wafer applications. The EPFL installation combines the MPI TS150 probe station with an Agilent 4155C Semiconductor Parameter Analyzer for DC characterization and a Zürich Instruments MFIA for AC characterization.[3][1]
The MPI TS150 uses a wafer chuck, a chuck XYT stage, a probe platen, microscope movement, and MPI micropositioners as part of its probe system architecture. The MPI TS150 uses binocular optics with a digital camera to center probe tips on contact pads. The MPI TS150 uses manual micro-manipulators with three-axis probe-tip movement to make soft and precise mechanical contact on pads. The EPFL installation includes MPI PM100 true X,Y,Z micro-positioners with interchangeable tungsten contact tips. The EPFL installation includes a fine-glide chuck stage on a highly stable granite base with 150 mm x 150 mm and 10 mm x 10 mm coarse and fine X-Y travel range.[3][1]
The EPFL installation supports wafers up to 6 inch as well as chips or parts of wafers. The EPFL installation includes selectable 4 quadrant LED illumination and microscope viewing through oculars or on a monitor. The EPFL installation provides an additional electrical connection to the chuck for conductive substrates. The Agilent 4155C configuration at EPFL provides 4 medium-power SMUs, 2 VSUs, and 2 VMUs. The Agilent 4155C configuration at EPFL supports measurement capabilities of +/- 40 V and +/- 100 mA on the SMU with 10 fA and 0.2 microvolt measurement resolution. The MFIA configuration at EPFL supports AC signal frequency from DC to 5 MHz, AC signal voltage from 0 to 2.1 V RMS, DC bias of +/- 10 V with 2 probes and +/- 3 V with 4 probes, and impedance range from 1 mOhm to 1 TOhm.[1]
Probe stations are used after fabrication has produced accessible pads or terminals on a wafer or die and before or instead of permanent package assembly. Probe testing fits into characterization, verification, failure analysis, and process monitoring workflows where direct electrical access to on-wafer structures is needed.
The EPFL installation is used to perform DC characterization of microelectronic devices under test such as resistance structures, diodes, and transistors. The EPFL installation is also used for AC characterization with a multi-frequency impedance analyzer. The EPFL installation includes 6 switching-box configuration options for standard applications such as FETs, bipolar transistors, diodes, and 2-point and 4-point general measurements.[1]
Documented failure modes, common issues, and field considerations.
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The EPFL configuration has a chuck compatible with wafer sizes up to 6 inch, chips, or parts of wafers.[1]
The EPFL setup is designed for electrical testing with a maximum of 4 independent terminals plus additional chuck grounding.[1]
The EPFL setup is coupled to an Agilent 4155C Semiconductor Parameter Analyzer for DC characterization and a Zürich Instruments MFIA for AC characterization.[1]
The following facts about the TS150 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the TS150 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the TS150 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the TS150 are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the TS150 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the TS150 are on record.
Answerable by: an OEM parts catalog or a service engineer
Last updated Oct 19, 2026.
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