Comparison ledger
MRSI H3TO, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | H3TOMRSI | 10100West Bond |
|---|---|---|
| OEM | MRSI | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | 2018 Launch announcement | — |
| Control system | Windows | — |
| Generation | — | — |
| Family | MRSI H3TO | West Bond 10100 |
| Cited variants | — | |
| Specifications | ||
| family | MRSI-H family[1] | — |
| design focus | handling multi-dies and multi-processes for complex TO products without tool changeover[1] | — |
| example products | TO-based EMLs and WDM LDs for 5G[1] | — |
| tooling/processing | TO handling module combined with pick and place head for dual parallel processing[1] | — |
| bonding capability | capability of both epoxy and eutectic die bonding in one process flow[1] | — |
| Type | high-speed die bonder[2] | — |
| Placement accuracy | 3 micrometer[2] | — |
| Designed for | handling multi-dies and multi-processes for complex TO products without tool changeover[1] | — |
| Control-system era | Windows[3] | — |
| Dual-head motion system | TO pick-and-place/handling and die bonding in parallel[2] | — |
| Auto tool changer | twelve vacuum tips/collets integrated on the bonding head for zero time tool change between dies[2] | — |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →