MRSI
H3TO
The MRSI H3TO is a 3 micrometer high-speed die bonder. The MRSI H3TO is designed for handling multi-dies and multi-processes for complex TO products without tool changeover. The MRSI H3TO uses a dual-head motion system that performs TO pick-and-place handling and die bonding in parallel.[1][2][3]
Performance
3 micrometer[1]
Control era
Windows
What it is
General reference — not yet source-verifiedDie bonders place semiconductor dies onto package substrates, carriers, or related package elements with controlled position and bond-process conditions. Die bonders are used in semiconductor assembly and photonics packaging after die preparation and before later package interconnect, enclosure, and test steps.
How it works
The MRSI H3TO builds on the MRSI-HVM3 platform. The MRSI H3TO includes a dual-head motion system that performs TO pick-and-place handling and die bonding in parallel. The MRSI H3TO also includes an on-the-fly auto tool changer with twelve vacuum tips or collets integrated on the bonding head for zero time tool change between dies.[1][5][3]
The MRSI-H-TO configuration is specifically designed for handling multi-dies and multi-processes for complex TO products without tool changeover. The MRSI-H-TO configuration combines a TO handling module with a pick and place head for dual parallel processing. The MRSI-H-TO configuration supports both epoxy die bonding and eutectic die bonding in one process flow.[2][4]
Where it fits in the process flow
General reference — not yet source-verifiedDie bonding sits in the assembly flow after wafer processing, dicing, and die preparation, and before later package completion and electrical or optical finishing. In photonic packaging, die bonding is commonly followed by interconnect formation, sealing or enclosure operations, and device test.
Applications
General reference — not yet source-verifiedDie bonders in this class are used for assembling semiconductor and photonic components where multiple dies must be attached into a package with controlled placement. Such tools are common in package build flows for optical transmitters, receivers, and related integrated optoelectronic assemblies.
- complex TO products
- TO-based EMLs
What do the numbers mean?
Vacuum & pumping1
- Auto tool changer
- twelve vacuum tips/collets integrated on the bonding head for zero time tool change between dies[1]
Performance1
Control & software1
Configuration & options8
- design focus
- handling multi-dies and multi-processes for complex TO products without tool changeover[2]
- tooling/processing
- TO handling module combined with pick and place head for dual parallel processing[2]
- Designed for
- handling multi-dies and multi-processes for complex TO products without tool changeover[2]
Vintage & configurations
Control-system eraWindows[2]
- 2018-08-29Launch announcement[1]
MRSI-H3TO was launched as a new product family.
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| MRSI-H-TO | — | — | Specifically designed for handling multi-dies and multi-processes for complex TO products without tool changeover; TO handling module combined with pick and place head for dual parallel processing; capability of both epoxy and eutectic die bonding in one process flow. | web.archive.org[2] |
| MRSI-H-LD | — | — | Standard system widely used in advanced photonics such as lasers, receivers, transceivers, lighting, and sensors; includes a heated head option for higher density eutectic packaging and an on-the-fly patented auto tool changer with twelve vacuum tips/collets integrated on the bonding head for zero time tool change. | web.archive.org[2] |
| MRSI-H-HPLD | — | — | Designed for bonding large high-power laser diodes in mass production; capable of die bonding single emitter and bar laser in different packages such as CoS, C-mount, and Bar-on-Submount (BoS); includes customized self-leveling tools for co-planarity solution. | web.archive.org[2] |
| MRSI-H-LDMOS | — | — | Designed for bonding GaAs, Si, GaN, and SiC dies for RF Power Amplifiers and Microwave Applications in mass production; includes programmable die scrubbing for void-free bonding and inline heaters, conveyors, and loader/unloader options for improved UPH. | web.archive.org[2] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Auto tool changertwelve vacuum tips/collets integrated on the bonding head for zero time tool change between dies[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What kind of machine is the MRSI H3TO?
The MRSI H3TO is a high-speed die bonder in the MRSI-H family. The MRSI H3TO was launched as a 3 micrometer die bonder with 3 micrometer placement accuracy.[1][6][3]
How does the MRSI H3TO handle multi-process assembly?
The MRSI H3TO builds on the MRSI-HVM3 platform and includes a dual-head motion system that performs TO pick-and-place handling and die bonding in parallel. The MRSI-H-TO configuration also combines a TO handling module with a pick and place head for dual parallel processing.[1][2]
Not publicly documented
The following facts about the H3TO are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented failure modes or field errata for the H3TO are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the H3TO is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the H3TO are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the H3TO are on record.
Answerable by: university cleanroom staff or an OEM application specialist
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (6)Every fact above is drawn from these public sources
- [1]mycronic.com — mycronic.commycronic.com
- [2]web.archive.org — web.archive.orgweb.archive.org
- [3]https://mb.cision.com/Main/17452/2602032/898378.pdf — mb.cision.commb.cision.com
- [4]waferpedia.com — waferpedia.comwaferpedia.com
- [5]MRSI launches MRSI-H3TO die bonding product family targeted at 5G wireless network supply chain — semiconductor-today.comsemiconductor-today.com
- [6]MRSI Launches New MRSI-H3TO Die Bonding Product Family Targeted at the 5G Wireless Network Supply Chain — prnewswire.comprnewswire.com
Last updated Oct 16, 2026.
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