Comparison ledger
Nikon i 12 D, Ultratech 1000 Family, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | i 12 DNikon | 1000 FamilyUltratech |
|---|---|---|
| OEM | Nikon | Ultratech |
| Category | Lithography | Lithography |
| Wafer size | Wafer Equipment | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Nikon i 12 D | Ultratech 1000 Family |
| Specifications | ||
| Version | 150 mm[1] | — |
| Resolution | 0.35μm or less (High resolution, positive resist film of 1.0μm thickness )[1] | — |
| Configuration | Focus Calibration Repeatability:[1] | — |
| Measurement of Initial Heat | 180 min[1] | — |
| Measurement of Initial Cool | 240 min[1] | — |
| Reticle Blind Setting Accuracy | + 0.4 to + 0.8 mm (on reticle)[1] | — |
| Wafer size | Wafer Equipment[3] | — |
| Tool type | — | Photolithography step-and-repeat 1X stepper[4] |
| Optical design | — | Wynne Dyson[4] |
| Magnification | — | 1X[4] |
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