Comparison ledger
Nordson 4000, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 4000Nordson | 10490West Bond |
|---|---|---|
| OEM | Nordson | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Nordson 4000 | West Bond 10490 |
| Specifications | ||
| Configuration | Windows 11 operating system[1] | — |
| Manufacturer | Nordson / Dage[1] | West Bond[4] |
| Model | 4000[1] | 10490[4] |
| Operating system | Windows 11[1] | — |
| Bond testing modes | Wire pull, ball shear, die shear, tweezer pull, vector pull[2] | — |
| Additional application modes | Bump pull[2] | — |
| Test force range (tensile) | 0–100 g, 0–1 kg, 0–10 kg[2] | — |
| Test force range (shear/thrust) | 250 g, 5 kg, 0–100 kg, 0–200 kg[2] | — |
| Test force range (tweezer pull) | 100 g, 5 kg[2] | — |
| Test force range (BGA ball pull) | 0–100 g, 0–5 kg[2] | — |
| Dimensions | 730 × 425 × 670 mm[2] | — |
| Weight | 45 kg[3] | — |
| Power supply | 100–240 V AC, 50/60 Hz[2] | — |
| Machine footprint | 425 mm W × 730 mm D × 670 mm H[3] | — |
| Z axis travel | 65 mm[3] | — |
| Z axis resolution | 0.125 micron[3] | — |
| Z axis maximum force | 10 kg pull at 5 mm/second[3] | — |
| Control software | Windows-based control software[2] | — |
| Sample compatibility | Bare silicon wafers (2", 4", 6", 8") and populated PCBs up to 300 × 300 mm[2] | — |
| Description | — | Convertible bonder, wedge to ball[5] |
| Tool type | — | Convertible bonder[6] |
| Bonding modes | — | Wedge bonding and ball bonding[6] |
| Use | — | Wire bonding[6] |
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