Nordson
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The Nordson 4000 is a bond tester. The Nordson 4000 is a modular testing platform for wire pull, ball shear, die shear, tweezer pull, and vector pull measurements. The Nordson 4000 runs on Windows 11 operating system.[1][2][3]

The Nordson DAGE 4000 Bond Tester is a destructive and non-destructive mechanical testing system used in the final stages of semiconductor packaging and assembly to verify interconnect integrity. The machine comes after wire bonding, flip-chip attachment, or ball-grid array (BGA) assembly in the process flow, providing quality assurance feedback on bond strength and failure modes. The system supports industry-standard test fixtures per JEDEC and IPC specifications for wire pull, ball shear, and die shear testing. The machine accommodates substrates ranging from bare silicon wafers (2-inch, 4-inch, 6-inch, 8-inch) to populated PCBs.[2][3]
The Nordson DAGE 4000 Bond Tester is used for quality assurance and failure analysis in microelectronics, semiconductor, automotive, and aerospace industries. The machine is suitable for testing wire bonds (gold, copper, aluminum), solder bumps (tin-lead, SAC, micro-bumps), die attach interfaces, ribbon bonds, and embedded passive elements. Specific applications include cold bump pull testing of solder balls from chip-scale packages, cavity shear testing with reduced ball deformation, vector pull testing for tab leads on packages, and zone shear testing for multiple rows on BGA and CSP packages.[2][3][5]
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The Nordson DAGE 4000 supports multiple testing modes, including wire pull, ball shear, die shear, bump pull, tweezer pull, and vector pull.[2][3][5]
The machine has dimensions of 730 mm by 425 mm by 670 mm (L by W by H) and weighs 45 kg.[2][3]
The power supply is switchable between 100 to 110 V AC and 220 to 240 V AC, at 50 or 60 Hz.[2][3]
The tensile force range is 0 to 100 g, 0 to 1 kg, and 0 to 10 kg. The shear/thrust force range is 250 g, 5 kg, 0 to 100 kg, and 0 to 200 kg.[2]
The XY stage has an accuracy of plus or minus 10 microns over 50 mm, and repeatability of plus or minus 5 microns over 50 mm.[3]
The following facts about the 4000 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 4000 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 4000 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 4000 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 4000 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 4000 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 12, 2026.
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