Waferpedia

Comparison ledger

Stellar 4000versus10100

Nordson Stellar 4000, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.

Email
Side-by-side comparison of selected equipment models
Attribute
10100West Bond
OEMNordsonWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyNordson Stellar 4000West Bond 10100
Specifications
ConfigurationSingle Phase[1]—
Power240 W[1]—
Full load Current3 A[1]—
ManufacturerNordson / Dage[1]—
ModelStellar 4000[1]—
Equipment typeBond tester[1]—
OperationManually operated production bond testing[2]—
Test modesWire pull, ball shear, die shear, bump pull, tweezer pull[2]—
Power supply100-240 VAC, single-phase[3]—
Frequency50-60 Hz[1]—
Force measurement principleElectro-mechanical load cell with frictionless transduction[3]—
Positioning accuracy±1 µm[3]—
System force accuracy±0.25 % FS[3]—
XYZ travel range100 mm × 100 mm × 65 mm[3]—
XY speedUp to 2 mm/s[3]—
XY resolution500 nm[3]—
Footprint705 mm × 562 mm × 675 mm[3]—
Weight86 kg[3]—
PC connectionEthernet[4]—
SoftwareParagon Lite[4]—
IlluminationSoftware dimmable LED[4]—

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]httgroup.euhttgroup.eu
  3. [3]instrumenthive.cominstrumenthive.com
  4. [4]nc-p-001.sitecorecontenthub.cloudnc-p-001.sitecorecontenthub.cloud