Waferpedia

Comparison ledger

200 Maskversus150 e Mask

OAI 200 Mask, SUSS MicroTec 150 e Mask, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
150 e MaskSUSS MicroTec
OEMOAISUSS MicroTec
CategoryLithographyLithography
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyOAI 200 MaskSUSS MicroTec 150 e Mask
Cited variants—
Specifications
ConfigurationDouble Sided[2]—
Model200[2]—
Typetabletop mask aligner[1]—
Resolutionone micron[1]—
Alignment precisionone micron[1]—
Alignment accuracy2 µm[3]—
Objectives5x, 10x, and 2x objectives[3]—
Exposure modescontact, soft-contact, and proximity[4]—
Light source optionscollimated Hg lamp UV light source or UV LED light source[1]—
UV LED wavelengths365nm, 405nm, or 436nm[1]—
Chuckdual windows in chuck for 4" wafers[2]—
Alignment axesX, Y, and Z micrometers[1]—
Frontside alignmentdesigned for high-precision frontside alignment in microfabrication processes[3]—

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Sources (4)Every fact above is drawn from these public sources
  1. [1]oainet.comoainet.com
  2. [2]inventory listing
  3. [3]cleanrooms.research.ucf.educleanrooms.research.ucf.edu
  4. [4]equipment-tools.research.iu.eduequipment-tools.research.iu.edu