Comparison ledger
OAI 6000, Ultratech 1000 Family, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 6000OAI | 1000 FamilyUltratech |
|---|---|---|
| OEM | OAI | Ultratech |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | OAI 6000 | Ultratech 1000 Family |
| Specifications | ||
| Product name | Model C&D P9000 / OAI 6000: Integrated Lithography Cell[1] | — |
| System type | Integrated lithography cell[1] | — |
| Process steps | Coat | Bake | Align/Expose | Develop[1] | — |
| Manufacture | Fully manufactured in the USA[1] | — |
| Configuration | Cluster configuration[1] | — |
| Wafer flow | Allows for dynamic wafer flow and parallel application processing[1] | — |
| Control interface | Single terminal for control over recipe and program selection; P9000 performs as the master user interface[1] | — |
| Operator requirement | Fewer operators needed in the lithography module[1] | — |
| Wafer handling | Reduced wafer handling[1] | — |
| Footprint | Small footprint[1] | — |
| Wafer size capability | Multiple wafer sizes can be processed simultaneously[1] | — |
| Product class | Automated Front & Backside Mask Aligner[2] | — |
| Application area | For production semiconductors, MEMS, sensors, advanced packaging, IOT, microfluidics[2] | — |
| Type | Automated Front & Backside Mask Aligner System / Integrated Lithography Cell[2] | — |
| Capabilities | Coat, Bake, Align/Expose, Develop[1] | — |
| Country of Manufacture | USA[1] | — |
| Wafer Size Support | Multiple wafer sizes can be processed simultaneously[1] | — |
| Tool type | — | Photolithography step-and-repeat 1X stepper[3] |
| Optical design | — | Wynne Dyson[3] |
| Magnification | — | 1X[3] |
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