Comparison ledger
Oxford Instruments 100 ICP Fluorine, Oxford Instruments Plasmalab 80 uP RIE, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 100 ICP FluorineOxford Instruments | Plasmalab 80 uP RIEOxford Instruments |
|---|---|---|
| OEM | Oxford Instruments | Oxford Instruments |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Oxford Instruments 100 ICP Fluorine | Oxford Instruments Plasmalab 80 |
| Specifications | ||
| Etch Gases | SF6, CF4, O2, Ar, N2, CHF3, C4F8[1] | — |
| Cryo DRIE etch rate | up to 5 µm/min[1] | — |
| Wafer size | 4 inch, 6 inch, 8 inch (with clamp change)[1] | — |
| Configuration | — | Includes vacuum pump[2] |
| Type | — | Reactive ion etcher[3] |
| Included configuration | — | Includes vacuum pump[2] |
| Main use | — | Mainly used for O2 plasma processing[2] |
| Known issue | — | Slit valve sometimes does not fully open when venting back to atmosphere after a run[2] |
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