Comparison ledger
Oxford Instruments 100 ICP Fluorine, Plasma-Therm SLR 770 Metal, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 100 ICP FluorineOxford Instruments | SLR 770 MetalPlasma-Therm |
|---|---|---|
| OEM | Oxford Instruments | Plasma-Therm |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Oxford Instruments 100 ICP Fluorine | Plasma-Therm SLR 770 |
| Specifications | ||
| Etch Gases | SF6, CF4, O2, Ar, N2, CHF3, C4F8[1] | — |
| Cryo DRIE etch rate | up to 5 µm/min[1] | — |
| Wafer size | 4 inch, 6 inch, 8 inch (with clamp change)[1] | 4 inch[3] |
| Configuration | — | Dual chamber[2] |
| OEM | — | Plasma-Therm[3] |
| Model | — | SLR 770 Metal[3] |
| Category | — | Etch[2] |
| Sample introduction | — | Load Locked sample introduction[3] |
| Vacuum & pumping | — | Turbomolecular pumping[2] |
| Process chamber | — | Left chamber is dedicated to chlorine based metal etching[3] |
| Condition note | — | Some issue with the source[3] |
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