Comparison ledger
Oxford Instruments 100 ICP Fluorine, Veeco RF 350 S, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 100 ICP FluorineOxford Instruments | RF 350 SVeeco |
|---|---|---|
| OEM | Oxford Instruments | Veeco |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Oxford Instruments 100 ICP Fluorine | Veeco RF 350 |
| Specifications | ||
| Etch Gases | SF6, CF4, O2, Ar, N2, CHF3, C4F8[1] | — |
| Cryo DRIE etch rate | up to 5 µm/min[1] | — |
| Wafer size | 4 inch, 6 inch, 8 inch (with clamp change)[1] | — |
| Configuration | — | 1 chamber[2] |
| Gas | — | Argon[2] |
| OS | — | Windows 2000[2] |
| OEM | — | Veeco[2] |
| Model | — | RF 350 S[2] |
| Category | — | Etch[3] |
| Tool type | — | Ion Mill[2] |
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