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Veeco

RF 350 S

EtchVeeco RF 350 family
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The Veeco RF 350 S is a one-chamber ion mill. The Veeco RF 350 S uses argon gas. The Veeco RF 350 S runs Windows 2000.[1][2]

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Fig. — Manufacturer logo, not a photo of this toolWikimedia Commons (see file page for license)

Power

RF 350 S[2]

Gas delivery

Argon[2]

What it is

The Veeco RF 350 S is an etch tool. The Veeco RF 350 S is an ion mill. The Veeco RF 350 S is configured as a single-chamber system. The Veeco RF 350 S uses argon gas. The Veeco RF 350 S runs on Windows 2000.[2][1]

How it works

General reference — not yet source-verified

Ion milling is a physical etch method. Ion milling tools generate ions from a process gas and direct those ions toward the wafer or substrate to remove material by sputtering. Ion milling is used when a process calls for directional material removal and close control of etched features. Single-chamber ion milling systems combine the process enclosure and the substrate handling space in one main process module.

Where it fits in the process flow

General reference — not yet source-verified

Ion milling tools are used in pattern transfer after film deposition and lithographic pattern definition. Ion milling tools usually sit downstream of coating, masking, and alignment steps, and upstream of resist stripping, cleaning, inspection, and later integration steps. Ion milling is commonly chosen when a process flow needs anisotropic removal of conductive, magnetic, or otherwise difficult-to-etch films.

Applications

General reference — not yet source-verified

Ion milling systems are used for subtractive patterning of thin films in semiconductor, compound-material, and microfabrication work. Ion milling is applied to materials and stacks that are more suitable for physical sputter removal than for reactive plasma chemistry. Ion milling is also used for device structures that depend on directional etching with limited chemical selectivity.

What do the numbers mean?

Power & electrical1

Model
RF 350 S[2]
Accurate?

Gas & chemistry1

Gas
Argon[2]
Accurate?

Configuration & options6

1 chamber[2]
Accurate?
Ion Mill[2]
Accurate?
OS
Windows 2000[2]
Accurate?
OEM
Veeco[2]
Accurate?
Category
Etch[1]
Accurate?
Tool type
Ion Mill[2]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What type of equipment is the Veeco RF 350 S?

The Veeco RF 350 S is an ion mill.[2][1]

How many chambers does the Veeco RF 350 S have?

The Veeco RF 350 S is a single-chamber system.[2][1]

Not publicly documented

The following facts about the RF 350 S are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the RF 350 S are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the RF 350 S are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the RF 350 S are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the RF 350 S are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the RF 350 S is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]waferpedia.com — waferpedia.comwaferpedia.com
  2. [2]inventory listing
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Last updated Oct 16, 2026.

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