Comparison ledger
Plasma-Therm Versaline ICP Deep Silicon, Tegal 110, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Versaline ICP Deep SiliconPlasma-Therm | 110Tegal |
|---|---|---|
| OEM | Plasma-Therm | Tegal |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Plasma-Therm Versaline ICP | Tegal 110 |
| Cited variants | — |
|
| Specifications | ||
| Phase | 208/220 VAC, 3 Phase[2] | — |
| Configuration | 30 A, 4-Wire[2] | — |
| Process type | Inductively coupled plasma etcher[2] | — |
| Application | Deep silicon etch[3] | — |
| Electrical requirements | 208/220 VAC, 3 phase, 30 A, 4-wire, 50/60 Hz[2] | — |
| Compatible materials | Si[3] | — |
| Incompatible materials | III-V / Hi K / Metal[3] | — |
| model | — | 110 SE[1] |
| application focus | — | process development applications[1] |
| process capability | — | deep silicon plasma etching[1] |
| capabilities | — | very high aspect ratio trench etch and profile control[1] |
| configuration | — | multiple configurations with minimum technical intervention[1] |
| System type | — | plasma etch system[4] |
| Supported components | — | MEMS and 3D-IC components[1] |
| Control capability | — | very high aspect ratio trench etch and profile control[4] |
| Physical description | — | compact[1] |
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