Comparison ledger
Rorze 03 RR 8120-001-001 Wafer Exchanger, Signatone TH-760, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | TH-760Signatone | |
|---|---|---|
| OEM | Rorze | Signatone |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Rorze 03 RR 8120-001-001 Wafer Exchanger | Signatone TH-760 |
| Specifications | ||
| Wafer size | 8 inch[1] | — |
| Manufacturer | Rorze[1] | — |
| Model | 03 RR 8120-001-001[1] | — |
| Equipment type | Wafer Exchanger[1] | — |
| Machine type | — | test head probe station[3] |
| Base structure | — | constructed around a vibration isolation table[3] |
| Probe station arrangement | — | the test head is docked beneath a large plate that floats on a cushion of compressed N2 or C.D.A.[3] |
| Access feature | — | a hole is milled into the plate to provide for probing into the device[3] |
| Support platen | — | a micropositioner support platen is mounted on top of the plate[3] |
| Mobility | — | the system has wheels so that it can be positioned above the test head[3] |
| Options | — | CAP (Computer Aided Probing), lasers, manual or motorized micropositioners, active probes[3] |
| Designed for | — | probing devices mounted directly in a test head[4] |
| Probe access | — | a hole is milled into the plate to provide access for probing into the device[5] |
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