Waferpedia

Signatone

TH-760

Test & ProbeSignatone TH-760 family
Research Quality: 40% complete
TH-760 — web.archive.org
Fig. 01TH-760web.archive.org[1]

What is it?

The TH-760 Test Head Probe Station is described as a probing system for semiconductor devices mounted directly in a test head. The source says it is constructed around a vibration isolation table, with the test head docked beneath a floating plate, and that options such as CAP, lasers, manual or motorized micropositioners, and active probes are available.

What can it run?

Process applications and technology nodes documented for this tool.

  • probing semiconductor devices mounted directly in a test head
  • failure analysis and R&D probing

Why won't it start?

Documented failure modes, common issues, and field considerations.

  • test head vibration can affect probing of small device geometries

What do the numbers mean?

Optics & imaging1

Options
CAP (Computer Aided Probing), lasers, manual or motorized micropositioners, active probes[1]
Accurate?

Configuration & options6

Machine type
test head probe station[1]
Accurate?
Base structure
constructed around a vibration isolation table[1]
Accurate?
Probe station arrangement
the test head is docked beneath a large plate that floats on a cushion of compressed N2 or C.D.A.[1]
Accurate?
Access feature
a hole is milled into the plate to provide for probing into the device[1]
Accurate?
Support platen
a micropositioner support platen is mounted on top of the plate[1]
Accurate?
Mobility
the system has wheels so that it can be positioned above the test head[1]
Accurate?
Interested in this tool?
Embed spec card

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Not publicly documented

The following facts about the TH-760 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the TH-760 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the TH-760 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the TH-760 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • The process node or technology generation of the TH-760 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the TH-760 are on record.

    Answerable by: an OEM parts catalog or a service engineer

Sources & citations

Sources (1)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.orgweb.archive.org
Was this page accurate?

Last updated Jul 29, 2026.

Compare with similar tools

View all →