Comparison ledger
Rorze 03 RR 8120-001-001 Wafer Exchanger, Teradyne Nextest Magnum V GV VP Memory, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Nextest Magnum V GV VP MemoryTeradyne | |
|---|---|---|
| OEM | Rorze | Teradyne |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Rorze 03 RR 8120-001-001 Wafer Exchanger | Teradyne Nextest Magnum |
| Specifications | ||
| Wafer size | 8 inch[1] | — |
| Manufacturer | Rorze[1] | — |
| Model | 03 RR 8120-001-001[1] | — |
| Equipment type | Wafer Exchanger[1] | — |
| Voltage | — | 208 VAC, 3 Phase[3] |
| Configuration | — | 24 power supplies[3] |
| Power | — | 208 VAC, 3 Phase[3] |
| Power supplies | — | 24 power supplies[3] |
| FLA | — | 185 Amps, 50/60Hz[3] |
| Input air pressure | — | 90-120 psi[3] |
| Software compatibility | — | Common API, tools, and SW feature set with Magnum, Magnum 2, Magnum 2x, and Magnum V[3] |
| Software release note | — | Magnum V SW release is a superset of Magnum 2x functionality[3] |
| Development environment | — | Windows 7 for off-line Development; Windows Server 2012 for Host PC; Windows 7 embedded for site controller; Microsoft Developer Studio 2010 for program development[3] |
| Per-site assembly contents | — | 2x PE256; 512 PE channels; 512 TG; ECR/DBM/LVM DIMMs; 2x DP4; 64 or 128 DPS; 64 or 128 HV; 32 PMU; 1x HSB; CPU interface; ECR DIMM extension option; CPU Quad Core; Power; Cooling[3] |
| One site assembly | — | 512 IO; 64/128 DPS; 64/128 HV; 32 PMU[3] |
| Large head | — | Double density site assembly: 512 I/O; up to 40 site assemblies; liquid cooled; modular slot architecture; site electronics; CPU; power/cooling; memory DIMMs; direct TIU signals; interchangeable DSA[3] |
| Applications | — | eMMC; Toggle NAND; Legacy NAND; ONFI FLASH; MCP; eMCP; LPDDR2; LPDDR3[3] |
| GV system | — | 20,480 I/O; 5120 DPS; 5120 HV/DC; single chassis, dual support cabinet; multiple handlers / TIU / DSA solutions[3] |
| EV | — | 1 or 2 slot; 512 or 1024 IO pins; 64/128 or 128/256 DC/HV pins[3] |
| EV engineering system and support cabinet | — | Small footprint for engineering lab; uses same DSA as production systems; low height support ThermoSystem; 1-4 EV Systems per support cabinet[3] |
| TW 350 DSA | — | Up to 16; 1 to 4 sites; 512 to 2048 IO[3] |
| TW 350 TIU | — | 2 per system; up to 512 per system; 8 to 32 site assys (4096-20,480 I/O); 16 DSA per TIU; GV or SSV system models[3] |
| Double density site assembly | — | 512 I/O[3] |
| Site 1 Slots | — | 1.2, 1.4, 1.5, 1.7, 1.8, 1.10[3] |
| Site 2 Slots | — | 2.1, 2.3, 2.4, 2.6, 2.7, 2.9[3] |
| Site 3 Slots | — | 3.2, 3.4, 3.5, 3.7, 3.8, 3.10[3] |
| Site 4 Slots | — | 4.1, 4.3, 4.4, 4.6, 4.7, 4.9[3] |
| Magnum V EV | — | Engineering system and Support Cabinet[3] |
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