Teradyne
Nextest Magnum V GV VP Memory
What it is
How it works
General reference — not yet source-verifiedSemiconductor memory testers generally connect the device under test through interface hardware and socketing so the tester can drive address, data, control, and power conditions while monitoring responses. Probe and test platforms of this class generally execute device programs that sequence patterns, voltage conditions, and measurement actions across parallel test sites.
Where it fits in the process flow
General reference — not yet source-verifiedTest and probe equipment sits in the electrical verification portion of semiconductor manufacturing rather than in front-end wafer fabrication patterning or deposition. Systems in this class are used after devices have been fabricated so manufacturers can determine whether die or packaged parts meet functional and parametric requirements.
Applications
What do the numbers mean?
Power & electrical6
Vacuum & pumping2
- Input Air Pressure 90-120 psi[1]
Wafer handling1
- GV system
- 20,480 I/O; 5120 DPS; 5120 HV/DC; single chassis, dual support cabinet; multiple handlers / TIU / DSA solutions[1]
Gas & chemistry2
Control & software6
- Software:[1]
- Windows Server 2012 for Host PC[1]
- Windows 7 embedded for site controller[1]
- Software compatibility
- Common API, tools, and SW feature set with Magnum, Magnum 2, Magnum 2x, and Magnum V[1]
- Per-site assembly contents
- 2x PE256; 512 PE channels; 512 TG; ECR/DBM/LVM DIMMs; 2x DP4; 64 or 128 DPS; 64 or 128 HV; 32 PMU; 1x HSB; CPU interface; ECR DIMM extension option; CPU Quad Core; Power; Cooling[1]
Dimensions & facilities1
- EV engineering system and support cabinet
- Small footprint for engineering lab; uses same DSA as production systems; low height support ThermoSystem; 1-4 EV Systems per support cabinet[1]
Configuration & options24
- SCCR skA[1]
- Common API, tools, and SW feature set with Magnum, Magnum 2, Magnum 2x, and Magnum V[1]
- Magnum V SW release is a superset of Magnum 2x functionality[1]
- Magnum 2x progrmas can be ported to Magnum V[1]
- New Development Environment:[1]
- Windows 7 for off-line Development[1]
- New API for New Magnum V Features[1]
- Each Site Assy Contains:[1]
- 2x PE256[1]
- 512 PE channels[1]
- 512 TG[1]
- ECR/DBM/LVM DIMMs[1]
- Large head
- Double density site assembly: 512 I/O; up to 40 site assemblies; liquid cooled; modular slot architecture; site electronics; CPU; power/cooling; memory DIMMs; direct TIU signals; interchangeable DSA[1]
- TW 350 TIU
- 2 per system; up to 512 per system; 8 to 32 site assys (4096-20,480 I/O); 16 DSA per TIU; GV or SSV system models[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Voltage208 VAC, 3 Phase[1]
- Configuration24 power supplies[1]
- ConfigurationFLA 185 Amps, 50/60Hz[1]
- ConfigurationInput Air Pressure 90-120 psi[1]
- ConfigurationMicrosoft Developer Studio 2010 for program development[1]
- Power208 VAC, 3 Phase[1]
- Power supplies24 power supplies[1]
- FLA185 Amps, 50/60Hz[1]
- Input air pressure90-120 psi[1]
- Development environmentWindows 7 for off-line Development; Windows Server 2012 for Host PC; Windows 7 embedded for site controller; Microsoft Developer Studio 2010 for program development[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What kind of equipment is the Teradyne Nextest Magnum V GV VP Memory?
The Teradyne Nextest Magnum V GV VP Memory is a memory test system in the test and probe category.[1][2]
Not publicly documented
The following facts about the Nextest Magnum V GV VP Memory are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Nextest Magnum V GV VP Memory are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Nextest Magnum V GV VP Memory are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Nextest Magnum V GV VP Memory are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Nextest Magnum V GV VP Memory are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Nextest Magnum V GV VP Memory is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Nextest Magnum V GV VP Memory — Teradyne | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 16, 2026.
Compare with similar tools
View all →The Tenney TPS JR-A-F4T is a junior compact temperature test chamber with a 1.2 cubic foot chamber size and a temperature range of -68°C to +180°C.
The Rorze 03 RR 8120-001-001 is a wafer exchanger for 8-inch wafers.
The KLA 1007 is a wafer prober manufactured by KLA.