Comparison ledger
SCREEN RF 300 A Photo Track, TEGAL 211, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | RF 300 A Photo TrackSCREEN | 211TEGAL |
|---|---|---|
| OEM | SCREEN | TEGAL |
| Category | Resist Processing | Resist Processing |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | SCREEN RF 300 A Photo Track | TEGAL 211 |
| Specifications | ||
| Configuration | Modifications:[1] | — |
| Robot Change | IHU, MHU (2), BHU[1] | — |
| Bake | CP (6), FRHP (7)[1] | — |
| Make | SCREEN / DNS[1] | — |
| Model | RF 300 A[1] | — |
| Modifications | Robot Change: IHU, MHU (2), BHU; Bake: CP (6), FRHP (7); Loadport (10); Cleanbooth; SC Cup Parts (2) (change and retrofit); SD Cup Parts, Nozzle (2) (change and retrofit); 10 L Nowpack Cabinet; ETU-Cab; Resist 8 High Viscosity (140 cp); Low Height Mod (Top Module Separation); BARC/Resist Separation Drain; Facility Connection Parts (change and retrofit); Power BOX Mod Parts (change and retrofit); Fire Suppression[1] | — |
| Resist 8 High Viscosity | 140 cp[2] | — |
| Refurbished RTP RTA | — | AG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[3] |
| KLA-Tencor Spare Parts and Service | — | RS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[3] |
| Refurbished Isotropic Plasma Etcher | — | Matrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[3] |
| Refurbished PECVD, ALD Equipment | — | Cambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[3] |
| Refurbished Mask Aligner | — | Canon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[3] |
| Refurbished Bonding | — | SUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[3] |
| Refurbished Wafer Prober | — | Electroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[3] |
| Process Type | — | Plasma Asher/Etcher[4] |
| Wafer Size (max) | — | 3 inch[4] |
| Form Factor | — | Table top[4] |
| Chamber Material | — | Aluminum[3] |
| Chamber Internal Dimensions | — | 6 x 6 x 3.75 inches[3] |
| Timer Range | — | 0-99 minutes[4] |
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